TSMC breaks ground on $9B fab complex
7/16/2010 12:03 AM EDT
SAN JOSE, Calif. -- Raising the stakes in the foundry market, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) has broken ground on its previously-announced, new 300-mm fab.
The plant, dubbed Fab 15, is located in Taichung’s Central Taiwan Science Park. Construction will be divided into four phases, and total investment over the next several years is expected to exceed NT$300 billion ($9.32 billion).
Fab 15 will be TSMC’s third Gigafab, or fab with capacity of more than 100,000 12-inch wafers per month. It will also be TSMC’s second Gigafab equipped for 28-nm technology.
''As capacity in Fab 15 grows, it will create 8,000 high-quality job opportunities, demonstrating TSMC’s dedication to corporate social responsibility,” said TSMC Chairman and CEO Morris Chang, in a statement.
TSMC is scheduled to begin equipment move-in for the phase 1 facility in June 2011, with volume production of 40- and 28-nm technology products for customers in the first quarter of 2012. More advanced process nodes will be introduced as TSMC’s technology development continues to advance.
In addition, to meet strong customer demand as we build Fab 15, TSMC will continue to expand capacity at Fab 12 in Hsinchu and Fab 14 in Tainan. Combined capacity of Fab 12 and Fab 14 currently exceeds 200,000 12-inch wafers per month, and is scheduled to exceed 240,000 12-inch wafers per month by the end of this year.