GlobalFoundries puts rivals on notice, tips 20-nm process
9/1/2010 9:25 PM EDT
No major surprises on process roadmap
Meanwhile, at its technology event, GlobalFoundries outlined its process roadmap, but there were no major surprises on that front, said Dean Freeman, an analyst with Gartner Inc. "They are on track" in terms of their process roadmap, he said.
Perhaps the only surprise was the disclosure of a new 20-nm process on the roadmap. GlobalFoundries declined to elaborate on the 20-nm technology, nor would it discuss the timetable for delivery.
Regarding its process roadmap, GlobalFoundries is more aggressive than most had thought. For example, on the processor side of the business, where it serves AMD, GlobalFoundries' roadmap "has been the most aggressive it has ever been," said Doug Freedman, an analyst from Gleacher & Co.
At present, GlobalFoundries has been ramping up 65-nm (and above) processes at Chartered's Fab 7 facility in Singapore. The Fab 7 facility will ramp "a little bit" of the company's 40-nm process, Grose said.
GlobalFoundries' Fab 1 facility in Dresden, Germany, will become the high-volume fab for the company's 45- and 40-nm processes. That fab is ramping to 80,000 wafers a month in the facility.
Within the fab, the company is shipping a 40-nm bulk process, based on a low power offering. The Dresden fab is also offering a 45-nm SOI process, mainly for AMD's processors. By the first half of 2011, GlobalFoundries will bring up a 32-nm SOI with its initial high-k/metal-gate (HKMG) scheme. The 32-nm process is also tuned for AMD's processors.
Surprisingly, even before 32-nm, GlobalFoundries will tape out a 28-nm bulk CMOS process with HKMG. The 28-nm process, which will initially be a high-performance offering, is expected to tape out by the end of 2010. Both 32- and 28-m HKMG offerings are based on a gate-first scheme.
At the event, the company announced the addition of a new technology offering based on its 28-nm HKMG technology. Scheduled to begin risk production in Q4 2011, the 28-nm High Performance Plus (HPP) technology provides a performance boost of as much as 10 percent over the company’s current 28nm High Performance (HP) offering.
The Dresden fab is starting work to help develop 22-nm CMOS process and will run the process in volume. It is not clear whether the 22-nm will include a departure from the gate-first HKMG technology.
In the future, Fab 1 will also become the home of a new 20-nm pilot line. GlobalFoundries' wafer fab under construction in New York state, Fab 8, would run the 22-nm production and more advanced nodes.
Construction for Fab 8 started in July of 2009. The fab will have 60,000 wafer starts per month once it goes into full production. Production is expected to go online in 2012.
With risk production set to begin in the second half of 2012, the company is well on its way to delivering 22- and 20-nm technology to customers for product introduction in 2013. The 20-nm technology offerings will come in two varieties: a High Performance (HP) technology designed for wired applications such as servers and media processors, and a 20-nm Super Low Power (SLP) technology designed for power-sensitive mobile applications.