LONDON – Falling wafer prices in the second quarter of 2010 contrasted with rising prices and allocation in the previous quarter, according to a survey conducted by the Global Semiconductor Alliance (GSA).
The median price paid for 200-mm diameter production CMOS wafers fell by 9.5 percent sequentially while 300-mm production CMOS wafers experienced no change quarter-over-quarter at $3,200, according to the GSA, non-profit organization that promotes and supports the semiconductor supply chain.
Participants in the survey also reported a decrease in mask set costs for 200-mm CMOS wafers, with the median decreasing 12 percent sequentially after two quarters of rising charges. The median mask set cost for 300-mm CMOS wafers remained unchanged as it has for three consecutive quarters, the GSA said.
Some packaging costs also decreased in the second quarter, the GSA said citing QFN packages down 5.3 percent in cost.
The survey of Q2 conditions is written up in the GSA's Q3 Wafer Fabrication & Back-End Pricing Report which covers wafer and mask costs by development stage, process geometry, number of metal layers, number of poly layers and epitaxial/non-epitaxial processes. Subscribers can also search assembly costs by such factors as package family, leads, units per week and substrate cost.
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