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goafrit
It is difficult to know what IBM does these days. They are into and out of many ...
elPresidente
Good to see IBM keep up with TSMC's 60V 0.18um process.
IBM rolls process for power management
Peter Clarke
9/16/2010 12:29 PM EDT
LONDON – IBM has announced a 180-nm chip-making process technology for power-management applications that can combine wireless communications and sensors.
The process, labeled CMOS-7HV, will be run primarily at IBM's wafer fab in Burlington, Vermont and the company is rolling out the process to manufacturers in the consumer electronics, industrial, automotive, digital media and alternative-energy segments. IBM is already accepting designs from customers and is scheduling full production for the first half of 2011.
CMOS-7HV includes a triple-gate oxide high voltage CMOS technology that operates at up to 50-V and extendable to 120-V. It also includes support for RF in term of precision polycrystalline, diffusion and well resistors, MIM capacitors and characterized vertical capacitors. The process offers three to seven levels of aluminum interconnect including thick last metal. There is a one-time programmable memory option and the I/O pins can be wirebonded or solder bumped.
As a result the process can integrate wireless communications and power management in a single chip. The company foresees the application of the technology in "smart" building monitor ICs, solar panels, energy grids, industrial, automotive and transportation systems. Chips based on the technology would also have a role in consumer electronics and mobile phones, the company said.
"By enabling more efficient power management in smart phones, IBM's technology opens up the possibility of using smaller, lighter batteries or needing less recharge time to provide the same amount of 'talk' time, video sharing or picture-snapping," said Jeff Hilbert, president and co-founder of Wispry Inc. (Irvine, Calif.) in a statement issued by IBM.
"Integrating communications and power sensors on one chip cuts costs for the industry and is an example of our 'smart-planet' technology vision – one that we back up with R&D," said Michael J. Cadigan, general manager, IBM Microelectronics Division, in the same statement.
Related links and articles:
GlobalFoundries puts rivals on notice, tips 20-nm process
Microsoft, IBM describe Xbox 360 250G chip
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Nic_Mokhoff
9/16/2010 12:52 PM EDT
This is good news for scaling more power efficiency in circuits that measure and compute and communicate wireless energy data; having this process available on the open market should bring focus to energy-management chips for end users and the power infrastructure.
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GREAT-Terry
9/16/2010 2:08 PM EDT
Great! Higher power handling ability with fine line process is very important. Hope to see more ICs designed with such great process.
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GREAT-Terry
9/16/2010 2:09 PM EDT
Just wonder if analog giants like ADI, Maxim, LTC will also proceed with similar process (or they outsource the fab to IBM). Anyone hear about it?
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peter.clarke
9/16/2010 2:37 PM EDT
but don't companies such as Austriamicrosysteme, X-Fab have similar capabilities?
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sak1
9/20/2010 7:40 AM EDT
DELTA Microelectronics is IBM's partner in Europe that will held a technical day regarding High Voltage IBM process technologies.
Click here:
http://www.madebydelta.com/delta/Business_units/ME/Specialty-foundry-ASIC-seminar.page?
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elPresidente
9/20/2010 3:37 PM EDT
Good to see IBM keep up with TSMC's 60V 0.18um process.
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goafrit
9/20/2010 5:33 PM EDT
It is difficult to know what IBM does these days. They are into and out of many things at the same time. I am happy they have not left technology for a better planet. Because it is only technology that will create a better planet.
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