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selinz
This is more evidence that Infineon's eWLB is truly catching some serious air. ...
STATS opens 300-mm wafer-level BGA plant
Mark Lapedus
9/20/2010 12:53 PM EDT
SAN JOSE, Calif. - STATS ChipPAC Ltd. recently celebrated the grand opening of its new 300-mm embedded wafer-level ball grid array (eWLB) manufacturing facility.
The official inauguration was recently held at STATS ChipPAC’s Yishun facility in Singapore. In April, STATS ChipPAC moved into production within the plant.
STATS ChipPAC expects to continue to invest to further expand its eWLB capacity and capabilities over the next three years. The company said eWLB ''has the potential to realize a higher number of interconnects with standard pitches at multiple wafer technology nodes.''
The official inauguration was recently held at STATS ChipPAC’s Yishun facility in Singapore. In April, STATS ChipPAC moved into production within the plant.
STATS ChipPAC expects to continue to invest to further expand its eWLB capacity and capabilities over the next three years. The company said eWLB ''has the potential to realize a higher number of interconnects with standard pitches at multiple wafer technology nodes.''
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selinz
9/20/2010 5:17 PM EDT
This is more evidence that Infineon's eWLB is truly catching some serious air. This is one of several techologies that extend Wafer level CSP type packaging to smaller die.
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