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SEMI forms LED standards group
Mark LaPedus
11/17/2010 5:07 PM EST
SAN JOSE, Calif. — Fab tool trade group SEMI has announced the formation of a high-brightness light-emitting diode (HB-LED) standards committee.
The committee initiated standards task forces on wafers, carriers, assembly and automation. The overall market for HB-LEDs will grow 68 percent this year to reach $9.1 billion, with projections of doubling in size to $18.4 billion by 2014, according to industry analysts at Strategies in Light.
During its inaugural meeting, the HB-LED Standards Committee agreed to form task forces in four critical areas of LED manufacturing:
1) Wafers: ''Unlike silicon wafers used in semiconductor manufacturing, there currently are no industry standards addressing wafer geometries, surface characteristics, wafer ID, wafer orientation, and other features, resulting in costly proliferation of wafer types and styles,'' according to SEMI. ''The objective of this Task Force will be to analyze and develop wafer standards (starting with sapphire wafers) that will reduce the proliferation of varying wafer types on the market — thereby reducing costs and enabling manufacturers to focus on true product and process innovation.''
2) Carriers: ''Wafer carrier standards will enable lower cost, higher precision, and more productive wafer handling, shipping, and processing,'' according to SEMI. ''The Task Force is expected to develop standards for shipping carriers.''
3) Automation: ''The objective of the Automation Task Force is to analyze and develop industry standards that allow low-cost, common hardware and software interfaces, and other means to enable HB-LED factories to effectively utilize multiple equipment types from multiple vendors in a highly automated and integrated fashion,'' according to SEMI.
4) Assembly: ''Currently, wire bonding and other assembly steps are highly varied depending on the unique optical, thermal, and electrical requirements of today’s advanced lighting applications— resulting in higher costs and lower throughput. The objective of the Assembly Task Force is to examine industry standards — relating to issues like machine vision, device orientation, handling interface, and other areas — that will enable lower-cost, higher-throughput assembly while recognizing diversity of component types in a typical HB-LED manufacturing environment,'' according to SEMI.
The committee initiated standards task forces on wafers, carriers, assembly and automation. The overall market for HB-LEDs will grow 68 percent this year to reach $9.1 billion, with projections of doubling in size to $18.4 billion by 2014, according to industry analysts at Strategies in Light.
During its inaugural meeting, the HB-LED Standards Committee agreed to form task forces in four critical areas of LED manufacturing:
1) Wafers: ''Unlike silicon wafers used in semiconductor manufacturing, there currently are no industry standards addressing wafer geometries, surface characteristics, wafer ID, wafer orientation, and other features, resulting in costly proliferation of wafer types and styles,'' according to SEMI. ''The objective of this Task Force will be to analyze and develop wafer standards (starting with sapphire wafers) that will reduce the proliferation of varying wafer types on the market — thereby reducing costs and enabling manufacturers to focus on true product and process innovation.''
2) Carriers: ''Wafer carrier standards will enable lower cost, higher precision, and more productive wafer handling, shipping, and processing,'' according to SEMI. ''The Task Force is expected to develop standards for shipping carriers.''
3) Automation: ''The objective of the Automation Task Force is to analyze and develop industry standards that allow low-cost, common hardware and software interfaces, and other means to enable HB-LED factories to effectively utilize multiple equipment types from multiple vendors in a highly automated and integrated fashion,'' according to SEMI.
4) Assembly: ''Currently, wire bonding and other assembly steps are highly varied depending on the unique optical, thermal, and electrical requirements of today’s advanced lighting applications— resulting in higher costs and lower throughput. The objective of the Assembly Task Force is to examine industry standards — relating to issues like machine vision, device orientation, handling interface, and other areas — that will enable lower-cost, higher-throughput assembly while recognizing diversity of component types in a typical HB-LED manufacturing environment,'' according to SEMI.
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