News & Analysis
Tell us What You Think
We want to know what you thought about this News. Let us know by adding a comment.
Spansion posts loss, ups capex
Mark Lapedus
1/26/2011 5:57 PM EST
SAN JOSE, Calif. - Amid a loss and some $454.0 million in disputed claims against the company, Spansion Inc. has raised its capital spending for 2011.
For the fourth quarter, flash memory vendor Spansion reported net sales of $327.7 million, an operating loss of $1.4 million, and net loss of $13.6 million. In the previous quarter, Spansion reported net sales of $307.6 million, an operating loss of $55.4 million, and net loss of $64.9 million. A year ago, Spansion reported net sales of $307.1 million, an operating profit of $20.7 million, and net profit of $4.3 million.
Spansion raised its capital spending from $61 million in 2010, to $90-$100 million in 2011, said Randy Furr, executive vice president and chief financial officer for the NOR flash player.
For the first quarter of 2011, Spansion estimates U.S. GAAP net sales and non-GAAP adjusted net sales in the range of $280 million to $305 million, GAAP net loss per diluted share of $0.11 to $0.26, and non-GAAP adjusted net income per diluted share of $0.30 to $0.47.
Some 45 percent of Spansion's output is outsourced to foundries. Spansion owns and operates one wafer fabrication facility in Austin, Texas (Fab 25), which has approximately 114,000 square feet of clean room space. This facility produces 200-mm wafers, manufactured using 110-, 90- and 65-nm process technology
''Third-party manufacturers we have used in the past or expect to use in the future for foundry and other manufacturing services include Texas Instruments, or TI, Fujitsu Semiconductors Limited, or FSL, Elpida Memory, Inc., or Elpida, and Semiconductor Manufacturing International Corp., or SMIC.,'' according to a recent filing.
In August 2010, Spansion entered into a new foundry agreement with TI as a result of TI’s purchase of two wafer fabrication facilities and equipment from Spansion Japan.
On March 1, 2009, Spansion, Spansion LLC, Spansion Technology LLC, Spansion International, Inc., and Cerium Laboratories LLC, or, collectively, each filed a voluntary petition for relief under Chapter 11 of the U.S. Bankruptcy Code in the U.S. Bankruptcy Court for the District of Delaware, or the Chapter 11 Cases.
Prior to the Debtors’ filing of the Chapter 11 Cases, on Feb. 10, 2009, Spansion Japan Ltd., a wholly-owned subsidiary of Spansion LLC, filed a proceeding under the Corporate Reorganization Law of Japan. Effective May 24, 2010, Spansion purchased the distribution business from Spansion Japan. Effective June 27, 2010, Spansion Japan’s Plan of Reorganization was confirmed by the Tokyo District Court.
Upon emergence from the Chapter 11 cases on May 10, 2010, Spansion Inc. adopted so-called fresh start accounting practices. At one time, there were some $1.479 billion in claims against Spansion as a result of its Chapter 11 filing.
Some $1.025 billion of those claims have been resolved, including a bitter dispute with Spansion Japan. There are still $454.0 million in claims outstanding against Spansion, including Tessera ($130 million), Samsung ($75 million), TEL ($56 million), Merrill Lynch Japan ($22 million), TSMC ($16 million), Nokia ($11 million), Motorola ($10 million), AMD ($10 million), Winbond ($6 million), King & Spalding ($2 million) and Ebara ($1 million).
For the fourth quarter, flash memory vendor Spansion reported net sales of $327.7 million, an operating loss of $1.4 million, and net loss of $13.6 million. In the previous quarter, Spansion reported net sales of $307.6 million, an operating loss of $55.4 million, and net loss of $64.9 million. A year ago, Spansion reported net sales of $307.1 million, an operating profit of $20.7 million, and net profit of $4.3 million.
Spansion raised its capital spending from $61 million in 2010, to $90-$100 million in 2011, said Randy Furr, executive vice president and chief financial officer for the NOR flash player.
For the first quarter of 2011, Spansion estimates U.S. GAAP net sales and non-GAAP adjusted net sales in the range of $280 million to $305 million, GAAP net loss per diluted share of $0.11 to $0.26, and non-GAAP adjusted net income per diluted share of $0.30 to $0.47.
Some 45 percent of Spansion's output is outsourced to foundries. Spansion owns and operates one wafer fabrication facility in Austin, Texas (Fab 25), which has approximately 114,000 square feet of clean room space. This facility produces 200-mm wafers, manufactured using 110-, 90- and 65-nm process technology
''Third-party manufacturers we have used in the past or expect to use in the future for foundry and other manufacturing services include Texas Instruments, or TI, Fujitsu Semiconductors Limited, or FSL, Elpida Memory, Inc., or Elpida, and Semiconductor Manufacturing International Corp., or SMIC.,'' according to a recent filing.
In August 2010, Spansion entered into a new foundry agreement with TI as a result of TI’s purchase of two wafer fabrication facilities and equipment from Spansion Japan.
On March 1, 2009, Spansion, Spansion LLC, Spansion Technology LLC, Spansion International, Inc., and Cerium Laboratories LLC, or, collectively, each filed a voluntary petition for relief under Chapter 11 of the U.S. Bankruptcy Code in the U.S. Bankruptcy Court for the District of Delaware, or the Chapter 11 Cases.
Prior to the Debtors’ filing of the Chapter 11 Cases, on Feb. 10, 2009, Spansion Japan Ltd., a wholly-owned subsidiary of Spansion LLC, filed a proceeding under the Corporate Reorganization Law of Japan. Effective May 24, 2010, Spansion purchased the distribution business from Spansion Japan. Effective June 27, 2010, Spansion Japan’s Plan of Reorganization was confirmed by the Tokyo District Court.
Upon emergence from the Chapter 11 cases on May 10, 2010, Spansion Inc. adopted so-called fresh start accounting practices. At one time, there were some $1.479 billion in claims against Spansion as a result of its Chapter 11 filing.
Some $1.025 billion of those claims have been resolved, including a bitter dispute with Spansion Japan. There are still $454.0 million in claims outstanding against Spansion, including Tessera ($130 million), Samsung ($75 million), TEL ($56 million), Merrill Lynch Japan ($22 million), TSMC ($16 million), Nokia ($11 million), Motorola ($10 million), AMD ($10 million), Winbond ($6 million), King & Spalding ($2 million) and Ebara ($1 million).
|
|
|
|
|
Navigate to related information