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docdivakar

2/6/2011 1:17 PM EST

@MarkLaPedus: it was good to see you at DesignCon last week. I remain skeptical ...

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SS123

2/4/2011 2:02 PM EST

testing!

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450-mm brings confusion to supply chain

Mark Lapedus

2/1/2011 8:38 PM EST

Forecasts and more forecasts
''Given the drastic cuts in semiconductor industry capital spending in 2008 and 2009 and a double-digit increase forecast for the IC market in 2010, 2011, and 2012, IC industry capacity utilization can be expected to remain relatively tight over the next couple of years,’’ warned Bill McClean, president of IC Insights, in a report. ''This in turn is forecast to lead to firming IC ASPs, extended leadtimes, and spot shortages.’’

In 2010, a 28 percent surge in wafer starts, coupled with the 6.4 percent increase in IC capacity, caused fab utilization rates to jump to 93.2 percent, up 15.5 percent over 2009, according to IC Insights. ''For 2011, (overall) IC industry capacity utilization is expected to rise to 93.8 percent before falling back slightly to 91.3 percent in 2012,’’ McClean said in the report.

Leading-edge, 300-mm capacity is expected to remain tight. ''Although in the ‘ramp-up’ stage, capacity utilization for leading-edge <40-nm devices was high in 2010 at 93.8 percent, up from the 90.3 percent figure witnessed in 2009. In 2011, leading-edge capacity utilization is expected to be very tight and register a 96.6 percent utilization rate,’’ he added.

IC Insights also forecasts a 22-point swing in semiconductor market growth (32 percent growth in 2010 and 10 percent growth in 2011), a 2-point difference for electronic system sales growth (11 percent in 2010 and 9 percent in 2011), and a  0.3-point difference in worldwide GDP growth (from 4.2 percent in 2010 to 3.9 percent in 2011).

In IC Insight’s most likely scenario, ASPs will see an increase of 2 percent in 2011, compared to 1 percent in 2010. Unit shipments are expected to grow 8 percent in 2011, down from 29 percent in 2009.

Jim Feldhan, chief executive of Semico Research Corp., said the IC market is expected to grow 8 percent in 2011, down from 31.8 percent in 2010. Capital spending is expected to grow 10 percent in 2011, with fab capacity hovering around 90 percent at the beginning of this year and cooling to 87 percent by year’s end, he said.

Dean Freeman, an analyst with Gartner Inc., sees a glut of capacity in the foundry sector in 2012,  as Globalfoundries, TSMC and Samsung are currently increasing their capital spending. The foundry business is expected to see 9.2 percent growth in 2011, down from 40.2 percent in 2010, he said. The IC market is expected to grow 4.6 percent this year, compared to 31.5 percent last year, he said.

For its own forecast, VLSI Research Inc. said the IC market will grow 8.1 percent in 2011, down from 30.9 percent in 2010.  And more importantly, 2011 is off to a better start than anticipated.

''Nearly all the chipmaking companies that have reported so far have beaten expectations. They expect Q1 growth to be above normal seasonal growth. This shows that after a weak Q4, the chip industry is roaring back thanks to a strong holiday season and an improving macroeconomic environment,’’ according to VLSI Research.

''The recent trend shows that overall inventories are tight and supply in the channel is dwindling,’’ according to VLSI Research in a report. ''NAND supplies, in particular, are very tight due to strong demand from electronics OEMs.  As a result, NAND spot prices jumped higher for the tenth straight week. DRAM is also improving. The decline for mainstream DDR3 has abated.’’




mark.lapedus

2/2/2011 11:54 AM EST

Is the industry going down the wrong path with 450-mm?

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Jim.Wieser

2/2/2011 1:00 PM EST

I had heard there was an "intermediate" wafer size between 300 and 450mm which is more cost effective from an equipment and infrastructure point of view. It would still provide a path for reduced $$/mm2 and in a more manageable way. Comments from the equipment industry?

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David Jimenez

2/2/2011 12:21 PM EST

It will be interesting to see the responses we get from our 5th annual process technology survey (currently underway at http://www.wwk.com/2011survey.pdf). The responses from the previous 4 surveys on 450mm manufacturing indicated more than 6 years out (39% responded never), more than 6 years out (56% responded never), beyond 2015(17% responded never), and beyond 2017(38% responded never).

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SiFarmer (Ret.)

2/2/2011 12:37 PM EST

C'mon guys? How many people think the wafer size is unlimited. What's next? A 1 meter wafer?!?

I predict Dr. Moore's Law will soon continue along other tracks than wafer size. You heard it here first! :)

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Jim.Wieser

2/2/2011 1:05 PM EST

I had heard there is an intermediate wafer size between 300mm and 450mm which is MORE cost effective than going to 450mm. Do any of the equipment manufacturers have comment on this?

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ScottenJ

2/2/2011 1:10 PM EST

There is no intermediate wafer size between 300mm and 450mm. 450mm is the next wafer size.

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GoGoGeek

2/2/2011 2:07 PM EST

400mm was planned long time ago. SEMI has a 400mm wafer in the lobby in San Jose as display. It is now 450mm.

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SudsSutherland

2/2/2011 2:18 PM EST

Folks seem to forget that Dan Maydan, then in the Office of the President at AMAT,suggested in the mid 90's that the industry should go directly to 450mm from the incumbent 200mm. What followed of course was the initial 300mm "false-start"

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mlvlvr

2/2/2011 4:10 PM EST

Judging by where 450mm is today, and how long it took 300mm to get into production (ignoring Motorola) from a similar point, we're looking at what, 7 years? That doesn't change any capacity issues for a long long time.

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lcovey

2/3/2011 11:57 AM EST

I think its a deliberate move from those few companies (read TSMC) to kill off its competition. The big companies that can afford it will do it to grab all the business cornering the market, much like OPEC controls oil prices.

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mark.lapedus

2/3/2011 7:09 PM EST

So is 450-mm a good or bad idea?

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SS123

2/4/2011 1:59 PM EST

Its certainly a good idea, for hi volume foundries anyways. I wonder what the limitation is on Si wafers, they are bound to crack at some point due to shear weight...

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SS123

2/4/2011 2:02 PM EST

testing!

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iniewski

2/3/2011 8:57 PM EST

Good for Intel and Samsung, bad for everyone else ;-)...dr Kris

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docdivakar

2/6/2011 1:17 PM EST

@MarkLaPedus: it was good to see you at DesignCon last week. I remain skeptical of TSMC's plan to have a pilot line for 450mm by 2013. Other market factors including the stabilization of flash memory prizes and their future fluctuations also have an impact on the urgency to drive the 450mm adoption.

Missing in the article are references to technology nodes that are going to be piloted in TSMC/other vendor fabs and their strategy thereof.

Lack of automation standards is a significant impediment but given the number of players wanting to participate in 450mm is so small, I hope it is easily resolved.

MP Divakar

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