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Pierre606

2/23/2011 10:11 PM EST

This is nothing short of a revolution in embedded technologies. OMAP is ahead of ...

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TXDigital

2/14/2011 9:15 PM EST

Flip chip

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Multiple cores power fifth generation of TI's OMAP

Colin Holland

2/7/2011 12:22 PM EST

Texas Instruments' believes its  OMAP 5 platform is expected to change the concept of ‘mobile’ by driving disruptive mobile computing experiences providing stereoscopic 3D, gesture recognition and computational photography based on multi-core processing, including ARM Cortex-A15 MPCore processors
 
The 28 nanometer OMAP 5 applications processors carry on the OMAP family tradition of delivering increases in performance and functionality, while lowering power consumption compared to their predecessors. They offer up to 3x processing performance and five-fold 3D graphics improvement, provide a nearly 60 percent average power reduction compared to a sample user experience on the OMAP 4 platform.

The OMAP 5 platform’s software is designed for maximum reuse to ease migration from the OMAP 4 platform.
 
The OMAP 5 processor uses two ARM Cortex-A15 MPCores capable of speeds of up to 2 GHz per core in the OMAP 5 implementation. The 50 percent boost in performance over the Cortex-A9 core (at the same clock frequency), is combined with up to 8GB of dynamic memory access and hardware virtualization support.
 
In addition to the two Cortex-A15 cores, the OMAP 5 processor includes individual, dedicated engines for: video, imaging and vision, DSP, 3D graphics, 2D graphics, display and security.

The processor also includes two ARM Cortex-M4 processors for offloading real-time processing from the Cortex-A15 cores to improve low-level control and responsiveness of mobile devices.
 
The OMAP 5 processor can support up to four cameras in parallel, as well as record and play back S3D video in 1080p quality, and perform real-time conversion of 2D content to S3D at 1080p resolution. The processor can also deliver advanced short- and long-range gesturing applications, as well as full-body and multi-body interactive gestures, utilizing either 2D or S3D cameras.

The OMAP 5 processor, coupled with a TI DLP Pico projector and a camera, can also enable interactive projection where the user can actually “touch and drag” projected images on both a table top or wall.
 
Additionally, the OMAP 5 processor can interface with and leverage a variety of sensor technologies to enable touchless sensing, such as proximity sensing, capacitive sensing and ultrasonic sensing.

The OMAP 5 processor includes hardware and software resources that enable the development and deployment of computational algorithms to improve picture and video quality from  built-in cameras. These provide camera stabilization, motion blur reduction, noise reduction, high dynamic range and face-based processing.

The latest processor goes a step further by using the same OMAP 5 hardware resources with vision algorithms to extract features and data from the picture, in order to implement applications such as face recognition, object recognition and text recognition. These vision capabilities can also be used as the foundation for augmented reality applications.


TI’s OMAP 5 platform is expected to sample in the second half of 2011, with devices on the market in the second half of 2012. The OMAP5430 processor is offered in a 14x14mm package-on-package  with LPDDR2 memory support.  The OMAP5432 processor is offered in a 17x17mm BGA package with DDR3/DDR3L memory support.  These products are intended for high-volume mobile OEMs and ODMs and are not available through distributors.

TI also plans to develop compatible ARM Cortex-A15 processor-based solutions for broader market applications across TI’s product portfolio.




hm

2/8/2011 5:42 AM EST

Very interesting product. Can it be directly interfaced to CMOS image sensor and can they also provide USB 3.0 and HDMI output support for live video of 1080P at 30fps and beyond?

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TXDigital

2/8/2011 6:58 AM EST

Yes, there are multiple camera sensor interfaces including multi-lane CSI-3, three CSI-2, parallel and even CSI-1/CCP support. Four cameras can be used simultaneously to support forward/backward stereoscopic 3D capture. For display output, you can use the two 4-lane DSI, HDMI 1.4a, USB 3.0, 24-bit parallel or even SPI in some cases. Four displays can be used simultaneously as shown in the OMAP 5 video that is on YouTube and all over the web.

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TXDigital

2/8/2011 7:03 AM EST

And up to 1080p60 or 1080p30 S3D for video output and up to QSXGA(2560x2048)for LCD output. You can also do wireless video streaming with the faster Wi-Fi or other technologies which is a trend that is happening. Some people may ask why do I need this for a smartphone, but the use cases are going to change - you will be able to use these in a variety of situations where you can connect to multiple displays and S3D imaging and video will become more ubiquitous.

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eewiz

2/8/2011 7:20 AM EST

Impressive! Thats like a total of 4GHz processing power. TI has realized that a late entry in a highly competitive market is almost like no entry. In the current generation of dual core cortex A9 CPUs nVidia has sealed its dominance with Google officially declaring Tegra-2 as its reference platform. TI dont want to miss the boat next time when Android 4.0 comes out and hence such a speedy execution. Even QCOM,who was the king of prev gen ARM chips, lost to nVidia. So they should also be thinking of something similar.

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selinz

2/8/2011 11:28 AM EST

So are we talking Android 4 here? or will we see this thing in portable units in the next 6 months?

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TingLu

2/8/2011 12:44 PM EST

A9 and A15 have the similar timing path depth. 28LP is not getting faster than 45LP. I am suspicious on 2GHz speed target TI is promising to deliver.

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jonnybegoode

2/8/2011 3:13 PM EST

Uhh, A15 is significantly heavier in both pipeline depth and width. See:

http://www.arm.com/files/pdf/AT-Exploring_the_Design_of_the_Cortex-A15.pdf

15-24 stage pipeline compared to A9's 9-12.

This thing will be a significant performance boost compared to A9. But it also looks like a power hog.

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eewiz

2/8/2011 1:26 PM EST

@ selinz. this cpu is targeted at Win 8/Android 4 crowd. IMO 6 months would be better , atleast they dont have to compete with Intel smartphone chips.

@TingLu see ARMs webpage
http://www.arm.com/products/processors/cortex-a/cortex-a15.php

They claim upto 2.5GHz.

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PackageGeek

2/9/2011 2:49 PM EST

Does anyone know if the (14x14mm)POP is flip chip or wire-bonded?

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TXDigital

2/14/2011 9:15 PM EST

Flip chip

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Pierre606

2/23/2011 10:11 PM EST

This is nothing short of a revolution in embedded technologies. OMAP is ahead of all the curves.

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