Analyst: OmniVision hit by yield issues
2/22/2011 7:13 PM EST
SAN JOSE, Calif. - OmniVision Technologies Inc. is having yield issues with its backside illumination (BSI) CMOS image sensors, according to an analyst.
OmniVision's lone foundry partner is Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). OmniVision is one of the world's largest CMOS image sensor makers.
''Recent data points have circulated in the past weeks suggesting OVTI's BSI yields have been adversely impacted out of TSMC, which could be backed-up on strong demand for general CMOS image sensors into smartphones and tablets,'' said analyst Doug Freedman of Gleacher & Co., in a new report.
''Our view is that the perceived yield issues could be more on the upcoming 1.1-micron BSI front; it is unknown whether TSMC will share the onus should production yields run materially below normal learning curve levels (could spare impact to OVTI's margins), as OVTI plays some 'catch-up' with Sony
on 1.1-micron (8 and 16MP module in the market) on process technology,'' he said.
OmniVision's public relations arm did not return e-mails regarding the report. The firm will report its results this week.
In November, OmniVision reported financial results for the fiscal second quarter ended Oct. 31, 2010. Revenues for the second quarter of fiscal 2011 were $239.5 million, as compared to $193.1 million in the first quarter of fiscal 2011, and $183.3 million in the second quarter of fiscal 2010.
GAAP net income attributable to OmniVision on the second quarter of fiscal 2011 was $28.9 million, or $0.50 per diluted share, as compared to net income attributable to OmniVision Technologies, Inc. of $16.9 million, or $0.30 per diluted share in the first quarter of fiscal 2011, and net income attributable to OmniVision Technologies, Inc. of $8.1 million, or $0.16 per diluted share in the second quarter of fiscal 2010.
Last week, OmniVision introduced its most advanced 8-megapixel image sensor to date, and the first to use OmniVision’s second generation OmniBSI-2 pixel architecture.
Implementing the latest developments in backside illumination (BSI) pixel technology, the OV8830 supports enhanced, fast frame rate image capture and 1080p or 720p high-definition (HD) video recording, making it highly suitable for feature rich smart phones.
OmniBSI-2 technology is OmniVision’s first pixel architecture built on 300 mm wafers using a copper process with 65-nm design rules, developed in close cooperation with strategic manufacturing partner TSMC.
Also last week, OmniVision introduced the OV3660, the company’s first 3-megapixel complimentary metal-oxide semiconductor (CMOS) image sensor based on its advanced OmniBSI pixel architecture.
The OV3660 extends the company’s portfolio of backside illumination (BSI) sensors based on its 1.4-micron OmniBSI pixel architecture. By incorporating this technology, the OV3660 offers high performance imaging, including 720p high-definition (HD) video recording, in an ultra-compact 1/5-inch optical format, making it an ideal choice for entry-level and mainstream smart phones.