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D2S, NuFlare ink e-beam deal
Mark LaPedus
3/1/2011 4:23 PM EST
SAN JOSE, Calif. - Design2Silicon (D2S), an emerging supplier of computational design platforms, and e-beam vendor NuFlare Technology Inc. have formed a partnership.
The entities will provide a D2S option for NuFlare's EBM-7000 mask writing system. D2S is a company providing a computational design platform to maximize existing e-beam technology to reduce mask costs for both low- and high-volume applications. D2S' design-for-e-beam (DFEB) mask solution reduces mask write times for high-volume designs with complex and circular features using existing e-beam mask writing equipment.
A new interface developed between NuFlare and D2S enables the overlapping of shots that was previously not allowed in NuFlare machines. Further, NuFlare announced that the EBM-7000 and its next-generation variable-shaped beam (VSB) systems ''will become field upgradable in the future with another new option to provide seven dose levels per VSB shape to utilize a wide variety of mask-process-correction (MPC) applications exploiting modulated doses.''
Currently, NuFlare VSB systems do not control the dose on a per-VSB-shape basis. By combining the dose control option with the D2S option, the D2S design for e-beam (DFEB) mask technology can take advantage of per-shot dose control, according to the companies.
With D2S DFEB mask technology, NuFlare's EBM-7000 and next-generation systems will be able to write complex mask patterns in acceptable write times—improving wafer yield while reducing the overall manufacturing cost of complex 22-nm photomasks.
In a statement, Hirokazu Yamada, senior manager for strategic planning for the Mask Lithography Division for Japan's NuFlare, said: "Our EBM-7000 system together with D2S DFEB mask technology enables our customers to reduce the shot count required to write complex masks and is particularly suitable for the 22-nm node. The ability to optimize the DFEB mask technology for the EBM-7000 and next-generation systems using overlapping shots will help broaden the adoption''
"D2S and NuFlare's collaboration is critical for accelerating the adoption of DFEB mask technology for our customers," stated Aki Fujimura, president and CEO of D2S and managing sponsor of the eBeam Initiative, in a statement. "The validation of our DFEB mask capability for the EBM-7000 system means that most semiconductor companies worldwide will have the ability to evaluate new and improved paths to
22 nm using optical lithography. This is once again evidence of the need and potential for design-to-manufacturing collaboration."
The eBeam Initiative is a forum dedicated to the education and promotion of a new design-to-manufacturing approach known as design for e-beam (DFEB).
The entities will provide a D2S option for NuFlare's EBM-7000 mask writing system. D2S is a company providing a computational design platform to maximize existing e-beam technology to reduce mask costs for both low- and high-volume applications. D2S' design-for-e-beam (DFEB) mask solution reduces mask write times for high-volume designs with complex and circular features using existing e-beam mask writing equipment.
A new interface developed between NuFlare and D2S enables the overlapping of shots that was previously not allowed in NuFlare machines. Further, NuFlare announced that the EBM-7000 and its next-generation variable-shaped beam (VSB) systems ''will become field upgradable in the future with another new option to provide seven dose levels per VSB shape to utilize a wide variety of mask-process-correction (MPC) applications exploiting modulated doses.''
Currently, NuFlare VSB systems do not control the dose on a per-VSB-shape basis. By combining the dose control option with the D2S option, the D2S design for e-beam (DFEB) mask technology can take advantage of per-shot dose control, according to the companies.
With D2S DFEB mask technology, NuFlare's EBM-7000 and next-generation systems will be able to write complex mask patterns in acceptable write times—improving wafer yield while reducing the overall manufacturing cost of complex 22-nm photomasks.
In a statement, Hirokazu Yamada, senior manager for strategic planning for the Mask Lithography Division for Japan's NuFlare, said: "Our EBM-7000 system together with D2S DFEB mask technology enables our customers to reduce the shot count required to write complex masks and is particularly suitable for the 22-nm node. The ability to optimize the DFEB mask technology for the EBM-7000 and next-generation systems using overlapping shots will help broaden the adoption''
"D2S and NuFlare's collaboration is critical for accelerating the adoption of DFEB mask technology for our customers," stated Aki Fujimura, president and CEO of D2S and managing sponsor of the eBeam Initiative, in a statement. "The validation of our DFEB mask capability for the EBM-7000 system means that most semiconductor companies worldwide will have the ability to evaluate new and improved paths to
22 nm using optical lithography. This is once again evidence of the need and potential for design-to-manufacturing collaboration."
The eBeam Initiative is a forum dedicated to the education and promotion of a new design-to-manufacturing approach known as design for e-beam (DFEB).
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