STATS ChipPAC expands TSV efforts

SAN JOSE, Calif. - Singapore's STATS ChipPAC Ltd. is expanding its 300-mm through-silicon-via (TSV) offering with the addition of ''mid-end'' manufacturing capabilities.

STATS ChipPAC was one of the first outsourced semiconductor assembly and test (OSAT) providers to invest in TSV technology with a 51,000 square foot research and development facility.

The latest TSV investment that STATS ChipPAC has made is the addition of a 300-mm “mid-end” process flow that occurs between the wafer fabrication and back-end assembly process. ''Mid-end'' processes support the advanced manufacturing requirements of 2.5D and 3D TSV as well as wafer level packaging, flip chip and embedded die technology.

"The driving demand behind 3D integration is the need to scale semiconductor devices to smaller and smaller geometries with higher input/output (I/O) requirements. STATS ChipPAC is enabling advancements in 3D packaging with the development and qualification of key technologies that support TSV solutions," said Han Byung Joon, executive vice president and chief technology officer at STATS ChipPAC, in a statement. "We have had the capability to fabricate, assemble and test TSV interposers for four years and believe the timing is right to invest in 300mm mid-end TSV manufacturing for our customers."