LONDON – Standard Microsystems Corp. (Hauppage, New York), which trades as SMSC, has announced that Samsung Electronics Co. Ltd. has licensed its patented Inter-Chip Connectivity (ICC) technology.
ICC enables the USB 2.0 protocol to be delivered over short distances consuming a fraction of the power of a traditional USB 2.0 analog interface while retaining software compatibility with a traditional analog USB 2.0 connection.
The High Speed Interconnect (HSIC) specification is an addendum to the USB 2.0 specification and incorporates the ICC technology. Where applicable, such as in portable applications, the ICC technology reduces power consumption and silicon area compared to an analog USB 2.0 interface.
The ICC technology of Standard Microsystems (SMSC) is described in U.S. Patent No. 7,702,832, which was issued to SMSC on April 20, 2010. Additional related patent applications have been filed by SMSC in the United States and other countries.
Companies wishing to implement short-range low-power USB interfaces may license SMSC's ICC technoloy patents under reasonable and non-discriminatory (RAND) terms, the company said.Related links and articles:
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