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R G.Neale
Mr Rbtbob-With respect to terbium and mechanisms of operation, as I have written ...
rbtbob
I agree that the patent is for a design that uses a combination of components ...
ISSCC: Samsung preps 8-Gbit phase-change memory
Peter Clarke
11/29/2011 6:28 AM EST
LONDON – Samsung Electronics Co. Ltd. is set to re-ignite debate about whether phase-change memory is commercially viable with the presentation of an 8-Gbit, 20-nm device at the 2012 International Solid-State Circuits Conference.
The development was not unexpected as Samsung engineers are due to present a 20-nm phase-change random access memory cell at the International Electron Devices Meeting coming up in Washington DC on Dec. 5 to 7, 2011.
Nonetheless a 20-nm, 8-Gbit phase-change random access memory is a large jump forward from the previous state of the art. In February at ISSCC 2011 Samsung engineers presented a 1-Gbit phase-change memory implemented in a 58-nm manufacturing process technology equipped with a low-power double-data-rate nonvolatile memory (LPDDR2-N) interface.
Samsung – and Micron Technologies Inc. through its acquisition of Numonyx NV – are the only two companies that have got close to offering non-volatile phase change memory for commercial use, despite years of research and development. And even so there are almost no reports of phase-change memories in the field.
Samsung is now set to present a large device in a 20-nm process technology operating at 1.8-V and with a 40-Mbyte/s programming bandwidth. This puts phase-change memory at close to the same geometry and memory cell density as NAND flash.
The ability within NAND flash to store and detect multiple bits per cell still gives flash a memory capacity advantage over PCM. Flash memory is also expected to go to a form that could stack multiple memory cells vertically, providing further memory capacity scaling.
Phase-change memory works by detecting the change in resistance of a chalcogenide alloy as it moves between amorphous and crystalline states under the action of resistive heating. It has long been hoped that the technology could combine the scaling advantages of a cross-point memory with the non-volatility of flash memory while offering superior endurance and bit addressability.
However, PCM has hit a number of barriers to deployment, not least the ability to get ahead of the fast scaling of NAND flash memory. Technical challenges to PCM continue to exist over the ability of the heating effect to scale both within the memory cell and due to thermal cross-talk effects on neighboring cells. There are also concerns on whether this sensitivity to temperature could prevent pre-programmed phase-change memories being taken through printed circuit board production processes such as solder baths.
The rules of ISSCC always were that papers could only be accepted if researchers had made real devices and taken physical measurements – in other words no simulation papers or ones based on design data. However, it was not necessary that devices worked fully or as intended.
Related links and articles:
ISSCC 2012 advanced program
News articles:
IEDM: PCM research moves to 20-nm
IEDM: Hynix takes NAND flash to 15-nm
IBM reports drift-tolerant multilevel cell PCM
China develops phase-change RAM
Samsung CEO: Headwinds hinder PRAM
NAND, PCM vie for attention at ISSCC 2011
Navigate to related information


resistion
11/29/2011 7:07 AM EST
They're also reporting on sub-20 nm NAND, that should be more interesting.
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resistion
11/29/2011 7:28 AM EST
If it's like last year, they still use a row data buffer.
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chanj
11/29/2011 11:57 AM EST
Given the technical challenges, what have Samsung's engineers done to make the commercialization of PCM viable?
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Volatile Memory
11/29/2011 12:27 PM EST
The author, Mr. Peter Clarke, knows very well that phase-change memory is a techno-Ponzi scam and that Samsung has long abandoned any efforts to commercialize this 40-year old technology in volume, after the disastrous performance of the 512Mbit PRAM MCP in a pre-production Samsung mobile phone last year (power consumption issues and write speed). Here is the proof: Can Mr. Clarke tell us where we can buy even a 1-Gbit phase-change memory chip? Phase-change memory will never be commercialized in volume as it has poor density, slow write speed, dismal durability, overheats, and cannot scale. However, phase-change memory remains a perfect vehicle for unscrupulous "researchers" to get a free vacation in the United States.
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dylan.mcgrath
11/29/2011 2:27 PM EST
@Volatile Memory: you seemd skeptical about the prospects for PCM.
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ilmenauer
11/29/2011 9:22 PM EST
I quite agree.
And i presume that Samsung engineers/managers understand it as well.
But you should also consider, that large teams were working on PCM development, so now they just can not so simply admit that their bet has lost (and lose face doing it, it is Asian company, after all).
So some activity will be continued, at least until major reshuffle in leadership happens and new managers could scrap the project (to everybody's relief).
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kinnar
11/29/2011 1:50 PM EST
Since they are going to display the PCM with current manufacturing technology, Samsung might be spending money and efforts behind the development of the Random Access PCM and Nonvolatile PCM, to know which one becomes preferable we will have wait along with time.
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Volatile Memory
11/29/2011 6:47 PM EST
kinnar: Would you please explain to us how non-random-access PCM and volatile PCM might look like, so that we know what we could wait for?
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R G.Neale
11/29/2011 6:17 PM EST
To date (including the one to be discussed at IEDM 2012 in a week or so) there will have been four 1 G-bit PCM memory chips from different manufacturers. I think in order to judge the future prospects for PCM, rather than requesting an answer to the question, where can I buy a 1G-bit PCM, it is more important to know the real and true reasons why you cannot buy one.
My view is there are two essential needs for the success of the introduction of any new memory technology; at any point in time it must offer an order of magnitude performance improvement over what is already available. Of even greater necessity, and to build confidence is the need for a continuity of products of increasing bit density and performance, accompanied by design wins. In the product continuity steps for monolithic PCM from 512M-bit to 8M-bits, the missing steps of devices with bit capacity of 1G-bit and 4G-bit is unusual to say the least. It maybe the powers that be at Samsung recognized they have slipped too far behind and decided that it has to be 8G-bit now or nothing. In the past ISSCC was always made more exciting waiting for the product announcement a week or so after the scientific paper was presented. Therefore we might have two bits of PCM news to look forward a 1G-bit product announced by Hynix, followed by the 8G-bit from Samsung in April. Personally on that count, based on the history of PCM developments todate I am less than optimistic.
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Volatile Memory
11/29/2011 6:55 PM EST
R G.Neale: Significant performance improvement is not sufficient. For volume manufacturing, costs matter as well. PCM has consistently lagged not only on the performance curve but also on the cost curve. PCM will never be commercialized in volume, so you are right to be less than optimistic. After all, more than 40 years have passed since you wrote the seminal paper on PCM showing that unlucky 256 bit (or was it 512 bit) sample!
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flyingunderradar2
11/29/2011 9:01 PM EST
You are still commenting on PCM. Since you are so sure that PCM will never be commercialized in volume why do you continue to post so much about it. Who do you feel you need to refute?
If you are indeed correct the current ENER stock price is proof enough.
What is your motive here Robert?
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R G.Neale
11/29/2011 7:30 PM EST
Mr Non Volatile Memory:-I think given the right product and demand, manufacturing costs can in most cases be reduced as part of the normal learning curve.
Unless, that is, those manufacturing costs are related to yield and linked to problems of a fundamental nature. If the VLSI2010 paper on a high performance PRAM cell (17 x 7.5nm)from Samsung is the precursor for the structure used in the 8G-bit, what I consider are unsafe extrapolations and conclusions in that work gives rise to my lack of optimism as far as the 8G-bit device is concerned. In that cell the calculated reset current density was 6.2 x10E+7Amps/sq-cm, it will be very interesting to see how Samsung have dealt with that as far as both matrix isolating devices and electro-migration as well as element separation in the PCM material from whatever its causes (J or E linked through the electrical conductivity of molten chalcogenide).
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eista
12/1/2011 11:21 AM EST
The reset current density issue has called attention in the industry. Will be interesting to see the 2011' IEDM paper from Macronix with 30uA reset current with 39nm contact size. The current density will be less than 10MA/cm^2.
Does Samsung have motivation to move to PCM mass production now, just imaging Samsung has PCM technology ready? Probably no, since Samsung has the biggest DRAM/NAND memory market share now and there is no other big player in PCM.
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resistion
12/2/2011 1:20 AM EST
2.5 MA/cm^2 is comparable to STT-MRAM. But it's still a little too hard to ask 45 nm MOSFET to provide the 30 uA.
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resistion
11/29/2011 7:53 PM EST
Samsung still has groups working on different types of memories, so they're bound to publish stuff that will attract detractors as well as supporters.
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rbtbob
11/29/2011 8:40 PM EST
Tyler Lowrey (Ovonyx) was issued patent 8,053,753 on 8 November for a complete thin film device with PCM and logic based on chalcogenide threshold switches. I believe these thin film computers will greatly advance the creation of robotic personal assistants. It will be a fairly straight-forward tweak to build in the cognitive functions recently documented here on EE Times. I hope Stan Ovshinsky lives long enough to see these robots demonstrate the culmination of his extraordinary work.
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Volatile Memory
11/29/2011 9:06 PM EST
rbtbob: Too bad what's left of Ovonyx has been already exiled to a university basement and the "company" will file for Chapter 11 by the end of 2012. Those robots will be quite funny since they will be slow memorizing, extremely unreliable, and will always run hot!
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flyingunderradar2
11/29/2011 9:21 PM EST
Keep short Mr. Bauer.
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flyingunderradar2
11/29/2011 9:33 PM EST
Mr Lowrey is still at it Mr. Bauer and that is why you are still posting as "Volatile Memory." You don't like the fact that Lowrey has the Edison perspiration factor and has savored success. What is your claim to fame?
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resistion
11/30/2011 8:40 AM EST
Samsung to do 10 nm NAND within a year.
http://4lovestoned.com/10-nm-nand-flash-volume-production-samsung-process-speed-who-can-argue-2126.html
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R G.Neale
12/2/2011 4:13 PM EST
Eista and Resistion--- post the IBM work, I think most of those trying to understand the PCM element separation (ES) problem now agree, that once the chalcogenide becomes molten the driving force for ES is electric field, that is it is an electrochemical process. During reset and before the chalcogenide becomes molten conventional electro-migration driven by current density is in play. Current density is important because it will drive electro-migration in the passive and active components in the matrix.
The reset current density can always be reduced, but that usually extracts a performance penalty in some other parameter. If you are Samsung then it appears from their PRAM cell…..VLSI2010 paper you can reduce w/e power in the same PCM structure (their figure 12) without consequences. Ignoring the fact that at some point in the process of that reduction the device will fail to operate and the lifetime will fall to zero. Even though their own data tends to indicate a maximum they ignore the reality of a maximum lifetime as a function of reducing w/e power.
In that same paper they do not consider that at some levels of reset (high current) the molten material will have metal as the electrodes, while at low reset current the electrodes in contact with the molten material will be crystalline chalcogenide. This means they are most likely extrapolating a single curve from what are in effect a series of different devices. I think we will need to look very carefully at the PCM related claims for PCM performance at both IEDM 2011 and ISSCC 2012. However, a serious and competitive product announcement (8G-bit or 1G-bit even),with (public) data sheets will kill much of the discussion.
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R G.Neale
12/3/2011 5:40 AM EST
Mr rbtbob-I think the patent you mention is one of those that might be useful for promotion and VC activities, but little else. For me reduction practice is necessary before I would become a believer.
Any discussion of threshold switches requires an answer to the simple question. Why has nobody been able demonstrated a long lived free running oscillator using the negative resistance of a threshold-switch; that is an oscillator that runs for more than a maximum of a few thousand cycles before device failure. When the reason for that is fully explained or a demonstration provided, the relevance of the patent can be discussed further. I think the answer to the free running oscillator problem points to the fundamental mechanism of threshold switching. I would suggest a clue will be found from the composition analysis of the threshold switch after it has been used in oscillator experiments.
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rbtbob
12/4/2011 11:46 AM EST
I agree that the patent is for a design that uses a combination of components that are not quite perfected. It is interesting that it proposes moving away from the silicon wafer process.
I believe some PCM researchers are developing the concept that a PCM cell would benefit from a reduction in the cell diameter. A diameter that is small enough to restrict the cell material molecules into having fixed pivot points as the conductive matrix forms and un-forms. I have a personal theory that this effect can be assisted by doping the cell material with Terbium. Maybe the same effect can improve the threshold switches.
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R G.Neale
12/5/2011 4:50 AM EST
Mr Rbtbob-With respect to terbium and mechanisms of operation, as I have written somewhere here in another comment, reduction to practice is necessary. That is reduction to practice in an environment that considers all the variables that will allow the device to be produced in array form. One thing is sure for any new compositions that are suggested as the active material for PCM or threshold switches, there is one question that must now be asked. It is, are they immune from the effects of element separation, from whatever the cause. J, E, or crystallization rejection processes.
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