Rick Merritt DesignCon wrap up; 3D stacking, optical interconnects EE
Times editor Rick Merritt wraps up some of the key trends at DesignCon
2012, including the shifts in design flow from copper to optical
interconnects and the cost dynamic challenges involved in that.
Video: Are tech jobs returning to the U.S.? EE Times hit the exhibition floor at DesignCon 2012 to get engineers' perspectives on whether high-tech jobs are coming back to the U.S. Panel probes T&M’s tech chiefs A DesignCon panel probed the leaders of the major test and measurement companies on a broad range of issues.
HP R&D chief shows road to terabyte backplane The long term future belongs to optical interconnects, low power processors and new kinds of memory architectures, said Prith Banerjee, director of HP Labs in a DesignCon keynote.
Discipline key to engineering innovation, says Microsoft’s Ilan Spillinger The convergence of technical trends is creating an environment full of innovative ideas, but delivering great products to market takes flexibility, focus, and discipline, said Microsoft Corporate Vice President Ilan Spillinger during a DesignCon keynote. CEO of iFixit blasts Apple for tiny torx screws CEO
of iFixit Kyle Weins blasted Apple for switching out its Phillips
screws for new tamper-resistant screws during a teardown at this year’s
DesignCon 2012. New versions of Wi-Fi expected to boost tablets
Chip makers and consumer electronics manufacturers are working to
improve the tablet user experience within the home, turning to newer
versions of Wi-Fi to improve connectivity and the ability to stream
content from tablets to TVs, a Broadcom executive said during a panel
discussion at DesignCon 2012. Lines blurring between digital, analog design worlds Lines
are blurring between the once distinct areas of digital and analog
design, necessitating new tools and new ways of design collaboration,
according to a panel of experts at the DesignCon 2012 conference. Wanted: 3-D IC standards within six months Standards for 3-D chip stacks need to be in place within six months to
stay ahead of chips rolling out in 2013, said a Qualcomm executive
driving some of the efforts. Why DesignCon? An editorial overview In this short video, EE Times roving editor Rick Merritt
discusses the attempts to merge multiple test tools in order to make the
entire testing process that much less complex. Xilinx launches first 7 Series FPGA design platforms
The first complete development kits for increasing system performance,
lowering power, and reducing BoM with Xilinx 28nm FPGAs are being
demonstrated at DesignCon 2012. DesignCon panel: No magic bullet for crosstalk
There is no perfect solution to the problem of crosstalk in modern
communications ICs, an increasing concern as chip designers push devices
into the realm of 28-gigabits per second and beyond, according to a
panel of experts at DesignCon 2012.
AMD's CTO talks heterogeneous systems architecture Making
parallel computing easy to program for and enabling software engineers
to let their imaginations run wild is AMD’s new holy grail according to
Joe Macri, AMD's chief technology officer, who delivered the opening
keynote at DesignCon 2012. DesignCon: Avago, TI hit signal milestones Avago Technologies and Texas Instruments are among the companies at DesignCon this week with new components to drive boards and cables to higher data rates over longer distances for less power and cost. They and their competitors are gearing up to enable a next-generation of systems using 100 Gbit/s Ethernet and 10+ Gbit/s interfaces. AMD’s Joe Macri challenges DesignCon attendees to embrace the future DesignCon 2012 keynoter AMD’s Joe Macri will deliver a challenge to the design community to embrace the enormous opportunities soon to be handed to them in the form of an advanced architecture. Microsoft keynoter to DesignCon attendees: 'Believe!' Microsoft’s Ilan Spillinger will kick off day two of DesignCon with an exciting keynote address that challenges the audience to harness the power to "believe" as the basis of their design work. Day 3 DesignCon keynote: The future is optics DesignCon keynoter Prith Banerjee will draw upon his vast experience as director of HP Labs and SVP of research in a talk that will breathe life to the complex realities of handling information within just the next few years. DesignCon Panel: Is it time for an analog comeback? A few months ago, I was asked to organize and moderate a panel for DesignCon. It seemed to me (given that I am kind of a digital guy) that DesignCon was being taken over again by the analog guys. It then occurred to me that more of the digital circuitry is beginning to behave more like analog these days and there are many parts of a chip where the two are becoming inseparable. Thus, the idea for the panel was formed.
Xilinx unveils latest and greatest 28nm 7 Series FPGAs Xilinx formally announced its participation at DesignCon 2012, with a focus on its 28-nm Series 7 FPGAs. Targeting RF security DesignCon 2012 will feature two live demonstrations of key recovery from mobile devices through RF electromagnetic signal analysis.
High-tech conference promises help with design DesignCon
2012 promises to address issues around PCB design tools, RF and signal
integrity, FPGA design, IC and semiconductor components, verification
tools, and high-speed serial design. Teardown of Vizio VTAB1008 tablet shows man-machine symbiosis There’s just something about the Vizio VTAB1008 8-inch Android tablet: You take it out of the box, turn it on, start using it, and right away you just get attached to it
