Rick Merritt DesignCon wrap up; 3D stacking, optical interconnects

SANTA CLARA, Calif.--EE Times editor Rick Merritt wraps up some of the key trends at DesignCon 2012, including the shifts in design flow from copper to optical interconnects and the cost dynamic challenges involved in that.

Rick also mentions free space optics, photonic computing and 3D chip stacking as the first steps towards the future.