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Wi-Fi chipset revenue to reach $6.1 Billion in 2015

Jean-Pierre Joosting

2/12/2012 3:04 PM EST

The Wi-Fi chipset market continues to march forward at a brisk pace as a growing number of consumer electronics are integrating Wi-Fi. As the demand for devices with Wi-Fi connectivity grows, and as prices for chipsets decrease, new markets for Wi-Fi are opening in areas traditionally dominated by other wireless connectivity standards.

According to the latest NPD In-Stat research, new markets such as smart meters, wireless mice, automobiles, and home automation will help drive sales of Wi-Fi chipsets to $6.1 billion in 2015.

"As Wi-Fi appears in more and more devices the demand for additional bandwidth will grow along with it," says Greg Potter, Analyst. "Granted, broadband speeds are not yet fully utilizing the available bandwidth allowed by Wi-Fi. However, newer use cases—such as streaming high-definition video from devices to the TV—necessitate an increase in bandwidth. New standards such as 802.11ac aim to provide that necessary speed increase."

Key research findings include:

  • The introduction of low-power Wi-Fi chipsets presents a challenge to Bluetooth in certain markets;
  • 802.11ac will grow rapidly with chipset shipments to surpass 650 million by 2015;
  • By 2015, the three biggest markets for 802.11ac will be smartphones, notebooks, and tablets;
  • All of the chips shipping in the automotive market will be Bluetooth/Wi-Fi combo chips.

NPD In-Stat research, Wi-Fi Chipsets: Is 802.11ac The New Black? provides recent news in Wi-Fi, analysis of new standards such as 802.11ac and Wi-Fi Direct, analysis of low-power chipsets, and of monolithic, combo, and embedded chipsets. Chipsets are forecast by type (monolithic, combo, embedded) and by standard (802.11a/bg, 802.11n, 802.11ac) with data provided for the years 2010 through 2015. Data and analysis are presented on the number of Wi-Fi chipsets shipped worldwide across 33 different product categories.

For further information: http://www.in-stat.com.

This article originally appeared on EE Times Europe.





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