LONDON – Flash memory vendor SanDisk Corp. (Milpitas, Calif.) is looking for a director of processing engineering management for a 3-D resistive RAM team based in Milpitas, something initially reported by Bright Side of News
. A job ad for the position was posted in SanDisk's website dated Feb. 15, 2012.
According to the posting, the individual will manage a team of about 30 engineers that is working to develop ReRAM switching material, a selector device and associated technology that can be manufactured with "acceptable 3-D product yield, reliability and performance."
The job is based at SanDisk headquarters in Milpitas, California, and the director's goal should be, the advert says, to bring the 3-D ReRAM technology from R&D to production. No time line is given in the advert for when production should be achieved.
Some of observers have stated that ReRAM may be introduced as a non-volatile memory technology as a replacement for NAND flash, which is thought to be close to the limit of planar scaling. However NAND flash could continue a form of scaling – and gain a temporary reprieve – by integrating multiple memory cells in the vertical dimension.
It would appear that SanDisk is looking to introduce ReRAM with a similar vertical, 3-D integration.
ReRAM research to date has usually been based on some form thin metal-oxide layer such as titanium-oxide although the device and material physics is often considered to be not yet fully understood or optimized.
To be in with a chance of getting the director job applicants are expected to have a second degree (MSc of PhD) and at least 15 years of relevant experience and 12 years of management experience. And they will need to be prepared to travel because the director will need work with SanDisk's partner Toshiba and be good at "co-developing technologies in actual fabs as well as with foundries in other countries."
There are also open positions at SanDisk for senior device engineers to develop and characterize flash and future memory technologies and a senior process integration engineer to define layout design rules for "various 3D NVM technology options." A lot of the jobs were posted mid-February suggesting a push is underway at SanDisk.
Other companies already some way down the road with ReRAM include Hewlett Packard working with Hynix Semiconductor Inc., Samsung Electronics Co. Ltd. and Elpida Memory Inc. Both Hynix and Elpida are expected to launch ReRAM chips in 2013.Related links and articles:
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