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ASMC 2012 tackles semi manufacturing challenges
Nicolas Mokhoff
5/8/2012 8:04 AM EDT
MANHASSET, NY -- The cost of maintaining productivity at a time of limited R&D resources facing the global chip-making community will be discussed at next week’s SEMI Advanced Semiconductor Manufacturing Conference (Saratoga Hilton, Saratoga Springs, NY) .
Keynote speakers include Michael Campbell Sr. Vice President, Engineering at Qualcomm who will look at mobile wireless driving the semiconductor industry; IBM Fellow Subramanian Iyer will discuss the evolution of embedded memory at IBM; and Risto Puhakka, President of market research firm VLSI Research, Inc. will provide IC market trends and forecasts.
With limited R&D dollars, it is unclear how wafer size transition, next node scaling, new transistor technology, and 3-D IC will be funded. A limited number of companies will pursue 450mm, but many more are looking at 3-D ICs.
A panel of executives from Globalfoundries, ASML, IBM, Applied Materials and VLSI Research will address limited R&D funding issues.
The full program is here. Register for ASMC 2012 here.
Keynote speakers include Michael Campbell Sr. Vice President, Engineering at Qualcomm who will look at mobile wireless driving the semiconductor industry; IBM Fellow Subramanian Iyer will discuss the evolution of embedded memory at IBM; and Risto Puhakka, President of market research firm VLSI Research, Inc. will provide IC market trends and forecasts.
With limited R&D dollars, it is unclear how wafer size transition, next node scaling, new transistor technology, and 3-D IC will be funded. A limited number of companies will pursue 450mm, but many more are looking at 3-D ICs.
A panel of executives from Globalfoundries, ASML, IBM, Applied Materials and VLSI Research will address limited R&D funding issues.
The full program is here. Register for ASMC 2012 here.
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