Dow Corning, SUSS MicroTec team on TSV chip packaging
6/25/2012 8:28 PM EDT
SAN FRANCISCO—Materials vendor Dow Corning Corp. and semiconductor manufacturing equipment vendor SUSS MicroTec AG said Monday (June 25) they would collaborate on a temporary bonding solution for 3-D through-silicon via (TSV) semiconductor packaging.
As part of this non-exclusive agreement, the companies are developing a material and equipment system solution for high volume manufacturing of 3-D TSV packaged devices, the companies said.
The Dow Corning silicon-based material—comprised of both an adhesive and release layer—is optimized for simple processing with a bi-layer spin coating and bonding process, the companies. Combined with SUSS MicroTec equipment, the solution offers the benefits of simple bonding using standard manufacturing methods and provides compatibility with thermal and chemical requirements for via middle and interposer TSV processing, as well as faster room temperature de-bonding required for advanced packaging applications, the companies said.
"Working side by side with Dow Corning expedited process development and this experience will facilitate faster implementation for customers interested in using the Dow Corning and SUSS MicroTec temporary bonding materials and equipment," said Frank Averdung, president and CEO of SUSS MicroTec, in a statement.