LONDON – SEMI, the international trade association that represents the interests of semiconductor equipment and materials companies, is planning for a 3-D packaging and through silicon via (TSV) meeting to be held in Grenoble, France, on January 22 and 23, 2013.
TSV is a key enabler of 3-D integration of ICs and is one of the areas of focus for European companies who have thought to avoid the expense of monolithic integration.
The event will include both a conference and an exhibition and will support and showcase the capabilities of leading European semiconductor companies in this area, SEMI said.
Participants are expected to demonstrate a full range of 3-D and R&D process from initial prototypes through to high-volume production.
A steering committee has been set up that includes representative of IMEC, CEA-Leti, Fraunhofer-IZM, Suss Microtec, SPTS, AMS and STMicroelectronics.Related links and articles:
CEA-Leti opens 3-D IC packaging service
Dow Corning and Suss cooperate on making 3-D TSV chips
GlobalFoundries installs gear for 20-nm TSVs
Applied Materials, IME open Singapore 3-D packaging lab
TSMC plans 3-D IC assembly launch early in 2013