News & Analysis
Intel to detail tri-gate advances at IEDM
Nicolas Mokhoff, Brian Fuller
12/6/2012 10:01 AM EST
Enduring memories
Macronix researchers built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed. Repeated program/erase (P/E) cycles degrade the tunnel oxide which insulates flash memory cells. In principle, heating the oxide will repair the damage but thermal annealing has been impractical because flash memories can’t tolerate the high temperatures and long baking times required. The researchers modified the word line from a single-ended to a double-ended structure, which enabled current to be passed through the gate to generate Joule heating. High temperatures (>800° C) thus were generated only in immediate proximity to the gate. The devices demonstrated record-setting endurance of >100 million P/E cycles with excellent data retention.
(Paper #9.1, “Radically Extending The Cycling Endurance of Flash Memory (to >100M Cycles) by Using Built-In Thermal Annealing to Self-Heal the Stress-Induced Damage,” H.-T. Lue et al, Macronix International) .
Deep trenches
A Massachusetts Institute of Technology research team has found a way to release, or remove, MEMS devices from a substrate after fabrication so that they can be integrated with CMOS. They did this by driving a MEMS resonator electrostatically using deep trenches that functioned as capacitors. The resonator frequency could be tailored easily via the lithography used to build the trenches, and the trenches also served as acoustic Bragg reflectors to confine and localize the resonance vibrations. The devices were built using a 32-nm SOI process. The 3.3-GHz MEMS resonator had a figure of merit (Q) of 2057, the highest reported to date for an unreleased MEMS resonator, according to the researchers. They claim this work paves the way for high-Q, multi-frequency sources to be built and intimately integrated in CMOS with no need for additional processing or packaging.
(Paper #15.1, “Deep Trench Capacitor Drive of a 3.3-GHz Unreleased Si MEMS Resonator,” W. Wang et al, M.I.T.)
Next: CMOS on plastic
Macronix researchers built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed. Repeated program/erase (P/E) cycles degrade the tunnel oxide which insulates flash memory cells. In principle, heating the oxide will repair the damage but thermal annealing has been impractical because flash memories can’t tolerate the high temperatures and long baking times required. The researchers modified the word line from a single-ended to a double-ended structure, which enabled current to be passed through the gate to generate Joule heating. High temperatures (>800° C) thus were generated only in immediate proximity to the gate. The devices demonstrated record-setting endurance of >100 million P/E cycles with excellent data retention.
(Paper #9.1, “Radically Extending The Cycling Endurance of Flash Memory (to >100M Cycles) by Using Built-In Thermal Annealing to Self-Heal the Stress-Induced Damage,” H.-T. Lue et al, Macronix International) .
Macronix researchers built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.
Deep trenches
A Massachusetts Institute of Technology research team has found a way to release, or remove, MEMS devices from a substrate after fabrication so that they can be integrated with CMOS. They did this by driving a MEMS resonator electrostatically using deep trenches that functioned as capacitors. The resonator frequency could be tailored easily via the lithography used to build the trenches, and the trenches also served as acoustic Bragg reflectors to confine and localize the resonance vibrations. The devices were built using a 32-nm SOI process. The 3.3-GHz MEMS resonator had a figure of merit (Q) of 2057, the highest reported to date for an unreleased MEMS resonator, according to the researchers. They claim this work paves the way for high-Q, multi-frequency sources to be built and intimately integrated in CMOS with no need for additional processing or packaging.
(Paper #15.1, “Deep Trench Capacitor Drive of a 3.3-GHz Unreleased Si MEMS Resonator,” W. Wang et al, M.I.T.)
MIT's deep-trench work paves the way for high-Q, multi-frequency sources to be built and intimately integrated in CMOS with no need for additional processing or packaging.
Next: CMOS on plastic
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kjdsfkjdshfkdshfvc
12/6/2012 10:54 AM EST
what , still no nano photonics devices in the pipeline, thats a shame,
if only someone made some Plasmonic Optical Tweezers Could Trap Tiny Proteins
An innovative aperture design based on plasmonics could focus light so effectively that tiny beams could trap and manipulate particles as small as a few atoms.
or we had a fiber optic spanner to adjust new Metamaterials and so Manipulate Light on a Microchip.
we probably need lots of sellotape ‘Smart’ Claw's
and OC the usual micron-scale spatial light modulator (SLM) that works in 3-D “free space” and runs orders of magnitude faster than those used in sensing and imaging devices today..
blah blah blah :)
did everyone at IEDM also forget Continuous gas-phase synthesis of nanowires with tunable properties
http://www.nature.com/nature/journal/vaop/ncurrent/full/nature11652.html
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song-chou-1
12/6/2012 11:07 AM EST
Intel's Finfet is best thing for foundry.
Intel keeps talking finFET but is not shipping 22nm FinFET products in mobile (feature-smart-phone or tablets) now or even next year.
After 2 years just 1 design is shipping(ivy bridge).
Achronix 22nm FPGA delayed until 2013
Haswell delayed to 2nd-half 2013
14nm delayed 1 year to 2nd-half 2014
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kjdsfkjdshfkdshfvc
12/6/2012 12:26 PM EST
actually does the "celeron" count in mobile sang-chou-1 ?
if so you will be finally seeing Celeron Ivy Bridge CPU's at the same time they release Haswell in the first half of 2013.
regarding that " tiny beams could trap and manipulate particles as small as a few atoms." rather than just light i always thought we don't use sound enough in electronics and heres just such a rather cool fully working project
using Ultra Tangibles
Creating movable tangible objects on interactive tables ultrasound is focussed into a beam, creating enough force to move lightweight objects across a surface.
mesmerizing video fukk of potential :)
http://big.cs.bris.ac.uk/projects/ultratangibles
scale this down to the micro/nano scale and it could be a very usable commercial product to manipulate particles and perhaps even perform some assembly, what you think , would nano scale ultrasound destroy the graphene nanowires etc http://www.graphene-info.com/electron-conductivity-studies-graphene-nanowires at the quantum mechanical process level
along side some Twisted beams of light could increase the capacity of optical communications.
http://www.nanomagazine.co.uk/index.php?option=com_content&view=article&id=1908:twisted-beams-of-light-could-increase-the-capacity-of-optical-communications-technology&catid=38:nano-news&Itemid=159
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