Samsung 14-nm FinFET test chip pushes ecosystem

SAN FRANCISCO -- Another 14-nm FinFET test chip has come to life, this time from Samsung, as the ultra-deep submicron ecosystem gains momentum.

The Korean chip maker, leveraging a team including ARM, Cadence, Mentor Graphics and Synopsys, announced Thursday (Dec. 20) that it has taped out multiple test chips ranging from a full ARM Cortex A7 processor implementation (using the low-power component of the ARM's "big-little" processor configuration/technology) to a SRAM-based chip capable of operation near threshold voltage levels as well as an array of analog IP.

Leveraging the emerging 14-nm ecosystem, Samsung:

• Tapped Cadence to implement the Cortex-A7 processor test chip in collaboration with ARM.  Cadence delivered the RTL-to-signoff flow, as well as  chip-level integration and verification. ARM used Cadence tools to develop the 14nm FinFET libraries.
• Used Synopsys tools optimized for FinFET devices to implement additional IP, including low-power SRAMs
• Leveraged Mentor for 14nm FinFET challenges including validation, manufacturing, and post-design production ramps.

The announcement was the second notable 14-nm FinFET achievement in a month.

In November, Cadence announced the tapeout of a 14-nanometer test-chip featuring an ARM Cortex-M0 processor implemented using IBM's FinFET process technology.

Related stories:
--Cadence, IBM push SOI FinFET design to 14-nm
--ARM TechCon probes road to 14-nm ICs
--FinFETs-on-SOI can double battery life, says GSS
--ARM, TSMC sign deal to ease FinFET process introduction