News & Analysis
DesignCon's 5 Toughest Tech Questions
Rick Merritt
12/28/2012 12:40 PM EST
What are T&M companies doing to keep pace?
DesignCon has always been my go-to place to understand what’s up in test and measurement. One evergreen panel in particular is well known for packing into an hour the issues building up over the last year. This year it includes experts from Agilent, Lecroy and Tektronix among others.
A National Instruments keynoter may shed additional light on the topic from a 30,000-foot level. Digging deeper into the details, one session will focus on how to handle the 8-Gbits/s speeds of PCI Express 3.0, and T&M companies including Rohde and Schwarz also are hosting a set of sponsored sessions to cover the waterfront of test in the gigahertz era.
Oh yeah, and where can we get an oscilloscope app?
A National Instruments keynoter may shed additional light on the topic from a 30,000-foot level. Digging deeper into the details, one session will focus on how to handle the 8-Gbits/s speeds of PCI Express 3.0, and T&M companies including Rohde and Schwarz also are hosting a set of sponsored sessions to cover the waterfront of test in the gigahertz era.
Oh yeah, and where can we get an oscilloscope app?
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rick.merritt
12/29/2012 4:43 PM EST
What are your burning questions in high-speed design? Join the conversation.
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docdivakar
1/1/2013 5:12 PM EST
Rick, I am looking forward to your next five... I would be curious to know what KAIST is going to present on 3D Stacks (haven't seen much from them on this).
Regarding 400Gbits systems, it could herald the beginning of the end of Copper chassis-to-chassis interconnects as we know it; for sure it will restrict the application to within cabinet interconnects. But there are still challenges on motherboards -need better dielectric materials which will drive up the costs, not to mention power and signal routing and signal integrity.
MP Divakar
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rick.merritt
1/2/2013 4:40 PM EST
KAIST has two 3-D papers at the event. One on TSV failures and the other looks more interesting on 2.5-D GPU and memory.
See http://www.designcon.com/santaclara/conference/tracks.php?session_id=239
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docdivakar
1/3/2013 12:34 PM EST
Rick, thanks for the link. I am caught up with emails from the holiday break and found the work of Prof. Joungho Kim of KAIST in Phil Garou's article:
http://www.electroiq.com/blogs/insights_from_leading_edge/2012/12/iftle-126-2012-gatech-interposer-conference-part-2.html?cmpid=EnlAPDecember192012
The link above describes some work of KAIST on glass interposers vs. Silicon. Interesting thing is that it is also the first instance where I see optical wave guides in the context of 2.5D/3D stacking.
MP Divakar
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nannasin28
1/21/2013 3:28 AM EST
there are still challenges on motherboards -need better dielectric materials. http://www.hqew.net
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