SANTA CLARA, Calif. – IBM sketched out its visions of the fab future at the recent Common Platform Technology Forum
, the chip alliance of IBM, Globalfoundries and Samsung. Specifically, an IBM scientist spotlighted double patterning tricks with immersion lithography. Big Blue also showed advances in fully depleted silicon-on-insulator and plans for silicon photonics, nanowires and other new twists ahead on the semiconductor road map. The following pages provide a few excerpts from the talks, starting with lithography.
“Since the 45 nm node we have been on a steady downward path, but [extreme ultraviolet lithography] can bring us back,” said Gary Patton, chief technologist in IBM’s semiconductor research group said, referring to the foil below. “EUV represents “the biggest change in the history of lithography [because] EUV light is extremely hard to work with—it’s absorbed by any material, including reflective lenses and masks,” he added.
Nevertheless, “I believe CMOS scaling will continue, [but] it will require disruptive technologies such as carbon nanotubes and silicon photonics,” he said.
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