Latest News
Headlines for Friday, July 30, 2010
Financial
Actel posts 2Q growth, names chairman
Business
Memory firms move up in semi rankings
Micron confirms support for phase-change memory
Renesas moves to fab-lite strategy
Q2 results: What analysts are saying
Analyst: Maxim readies parts at Powerchip's 300-mm fab
Qualcomm forms Indian joint venture
Patent pool uncertainty looms over LTE roll out
Cranfield Aerospace uses antennas from Cobham Antenna Systems for Boeing X-48B prototypes
Earth has enough copper for e-mobility, researchers say
Group to define benchmark for deep packet inspection
Technology
Nanofibers-on-silicon harvest mechanical energy
Student Entrepreneur shakes to charge
IBM crafts silicon optical amplifier
Headlines for Thursday, July 29, 2010
Financial
Samsung posts record profit on strong chip sales
Analog semiconductor makers join earnings rally
LSI blames customer inventory adjustments for Q2 miss
Business
Intel wins ruling in class action suit
KLA, Varian beat forecast; MEMC misses
VLSI ups IC forecast, but CEOs remain cautious
Spoof: Top 10 fears of today’s engineers
15 unknowns for electronics companies
TSMC forecast tips chip cycle nearing its peak
Motorola Q2 net rises on higher margins
TSMC sees Q2 sales climb, modest growth in Q3
Home media server embraces car infotainment
EDA startup Sigasi raises funds
Product
ST offers dual-core Cortex-A9 processor for embedded apps
Technology
SPARK Pro provides Secunet with security for interactive system
Design
EU embedded project SPEEDS to conclusion
EnSilica declares 'open season' on 8051 MCU
Headlines for Wednesday, July 28, 2010
Financial
More fab tool vendors top expectations
Acquisition-related tax benefit boosts Cadence
Nvidia warns of revenue shortfall
Business
ASMI buys Siemens' SMT business
Memcon: ASML, vendors to blame for shortages
Report: Renesas plans massive layoffs
Memory interface group claims to be back on track
MediaTek takes LTE license, partners with Docomo
3-D TV shipments forecast to grow to rapidly
Space Log: Sally Ride and engineering
Infineon boosts profits, outlook, capex
Foxconn sizzles on Apple patronage
Synopsys' Design Compiler Graphical used for hearing-aid DSP
Technology
MEMS startup aims picoprojectors at 3-D modeling
Phase-change memory: A rebuttal of Micron’s article
Product
ADI - Xilinx collaboration streamlines base station design
Headlines for Tuesday, July 27, 2010
Business
Analyst: Chip market on track for record increase
Analyst: Flash is hot, supply chain is not
Debate rages over future of U.S. fabs
Rambus prevails over Nvidia. So what?
Solar firm names chip exec as CEO
Analysts cut estimates for Nvidia
Lab offers to test IEEE 802.3ba Ethernet standard
MeeGo in-vehicle win gives embedded Intel a boost
Micron shows support for phase-change memory
ARM reports sales, profits up in Q2
Telairity simulates video compression ICs with Magma's FineSim
Financial
Broadcom beats analyst views on record sales
Technology
Intel demos 50-Gbit/s silicon optics
Graphene beats silicon nitride
Product
Headlines for Monday, July 26, 2010
Technology
Researchers say carbon-based platform beats silicon for detection
Business
Nvidia: ITC ruling won't affect customers
Motorola stages handset comeback
U.S. says ‘jailbreaking’ iPhones is legal
CEOs: Still room for fab tool startups
PSA secures loan to finance plug-in hybrid development
TV chip market to rise 30% in 2010, says iSuppli
European smart meter market to boom, says Berg
Fairchild plans to appeal PI patent ruling
NXP buys Jennic, boosts short-range RF portfolio
Volkswagen bundles global e-mobility R&D efforts
NetLogic packs 32 cores in four-chip module
Design
ESC panel: Indian design climbs the value chain
ST, Digi-Key offer $5,000 prize in student contest
Product
Mentor - NI collaboration speeds test bench development
Headlines for Saturday, July 24, 2010
Product
Digi and GroundedPower partner to enable reduced energy consumption
Noteworthy in Design
Using in-design physical verification to reduce tapeout schedules
Look at manufacturing issues during the design phase, and how they affect critical IC-design issues such as DRC violations and tape-out schedule.
