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EE Times Digital Edition - October 10, 2011
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Maybe you've heard this before: The foundation of semiconductor fabrication will soon be transformed as multistory structures rise up from today's planar dice.
This week's cover story, entitled "Multidimentional efforts push forward 3-D Chips," gets you current with state-of-the-art 3-D ICs and explains how the industry's big players are perfecting the technology.
This week's cover story, entitled "Multidimentional efforts push forward 3-D Chips," gets you current with state-of-the-art 3-D ICs and explains how the industry's big players are perfecting the technology.
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