Rugged COM Express Type 6 module targets mobile apps

ADLINK Technology Inc. released its latest Ampro by ADLINK Extreme Rugged COM Express module, the Express-HRR for mobile applications running in harsh environments.

The Ampro by ADLINK Express-HRR is a COM Express Type 6 module based on the quad/dual-core 2nd Generation Intel Core i7 processor and Mobile Intel QM67 Express Chipset. Following ADLINK's Rugged By Design methodology, the Express-HRR is ideal for use in environments prone to severe shock, vibration, humidity, and extended temperature ranges.

The Ampro by ADLINK Express-HRR is aimed at mobile applications running in space constrained, extreme rugged environments. The Express-HRR is compatible with the COM Express COM.0 Revision 2.0 Type 6 pinout, which is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display Interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies. The new Type 6 pinout also supports the SPI Interface, which was unavailable in COM.0 Rev. 1.0.

Key highlights:

• Powered by a quad- or dual-core 2nd Generation Intel Core i7 processor
• Offers up to 16GB ECC 1333MHz DDR3 memory in two SODIMM sockets
• Three DDIs for DisplayPort/HDMI/DVI/SDVO
• Eight PCIe x1 and one PCIe x16 (Gen2) for graphics (or general purpose x8/4/1)
• Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, and eight USB 2.0 interfaces
• Supports extended temperatures ranging from -40°C to +85°C
• Features a 50% thicker printed circuit board (PCB) for high vibration tolerance

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