Modular mezzanine interconnect delivers signal integrity at 28+ Gbps

Molex Inc. has launched a new modular NeoScale mezzanine interconnect system capable of achieving optimal signal integrity at data rates of 28+ Gbps. 

Designed for printed circuit board (PCB) mezzanine applications in enterprise networking towers and telecommunication hubs and servers, in addition to industrial controllers and medical and military high data-rate scanning equipment, the NeoScale mezzanine interconnect features a patent-pending triad wafer configuration that isolates each differential pair for optimal performance and customization. 

The honeycomb construction of the NeoScale mezzanine interconnect housing routes each triad to minimize crosstalk and effectively route out of the PCB in one or two layers, essentially saving designers in the cost of PCB material.  In addition, unique tombstone structures located in the connector housing protect the mating interface and flexible contacts to help prevent damage to the terminals. 

Featuring a density of 82 differential pairs per square inch, the NeoScale layout can be customized with high speed differential pairs, high speed single ended traces, low speed single ended lines and power contacts.  Available with 85 and 100 Ohm impedance and mated stack height range of 12 to 40mm, NeoScale design options include 6 to 30 circuit column sizes with 2, 4, 6 and 8 row options available, ranging from 12 to 240 triads in one assembly. 

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