BRISTOL, Pa., Dec. 19, 2011 /PRNewswire/ -- Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products used worldwide, now offers the industry's first CSP sockets that accept any area-array device for high-temperature testing up to +200 degrees C. The new AR4HT Series sockets incorporate a low-profile 0.45 mm contact structure (compressed) that is shorter than other low-profile contacts and provides excellent compliance for reliable ATE testing and burn-in.
(Photo: http://photos.prnewswire.com/prnh/20111219/PH24881 )
For the first time, applications that require high-temperature device testing and burn-in, as well as those with high-frequency bandwidth, low inductance and high current conditions, can now incorporate cost-effective and high-reliability CSP socket technology to test and burn-in virtually any area-array device at temperatures up to +200 degrees C. The sockets are successfully employed in military, aerospace and geophysical environments as well as in research and development.
The AR4HT sockets accommodate a variety of area-array devices including BGA, LGA, QFN, DFN, CSP, MLCC and POP as well as bumped die with full and partial arrays. Full socket operating temperature is -55 degrees C to +200 degrees C with a life expectancy of more than 10,000 actuations. The socket can accommodate IC devices with a pitch of 0.4 mm or greater as well as mixed pitch environments.
The interposer set is comprised of silver particles within a silicon elastomer with a patented polyimide core. Initial contact force is 20 to 30 grams per lead.
As with all Aries test and burn-in sockets, the new AR4HT series is available in custom sizes and configurations to suit specific customer applications.
Pricing for an AR4HT socket starts at $175. Delivery is 20 work days ARO.
For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: firstname.lastname@example.org; Web: http://www.arieselec.com, Data sheet # 23026 http://www.arieselec.com/Web_Data_Sheets/23026/23026.htm, Europe Email: email@example.com.
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EDITORS NOTE: From its Bristol, Pa. facility, Aries Electronics Inc. manufactures an extremely broad range of custom and standard interconnection and packaging products used worldwide for a variety of electronics applications. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the "intelligent" Correct-A-Chip™ product line; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.
The Simon Group, Inc.
Christina Sanchez or Beth Smith
Phone: (215) 453-8700
SOURCE Aries Electronics