- Products
- Product Reviews
- Product How Tos
- New Product Releases
- Product Categories
Product Review
COM Express Type 2 module boasts 3rd gen Intel Core processors
Toni McConnel8/9/2012 5:18 PM EDT
The conga-BP77 3rd generation Intel Core module from congatec, Inc. is based on the COM Express Type 2 connector pin-out and supports the PCI Express graphics port for high-performance external graphics. The cmodule is well suited to medical, gaming, and multimedia applications needing high end graphics performance where the internal graphics support from the chip set does not suffice. The crucial innovations of the 3rd generation Intel Core processors relate to the use of 3D trigate transistor technology, 22 nanometer production, more tightly integrated graphics and the improved PEG 3.0 graphics. The change from PEG 2.0 to PEG 3.0 is the performance increase from 5 GT/s to 8 GT/s.
The conga-BP77 is available now with processor support for Intel Core i7-3612QE (4 x 2.1 GHz, 6 MB Intel Smart Cache, TDP 35W), Intel Core i7-3555LE (2.50 GHz, 4 MB Intel Smart Cache, 25W) and Intel Core i5-3610ME (2.7 GHz, 3 MB Intel Smart Cache, 35W). The module features the new mobile Intel Express chip set QM77 and offers up to 16 GByte dual channel DDR3 memory (1600 MT/s).
Six PCI Express 2.0 lanes, four SATA interfaces with up to 6 GB/s and RAID support, eight USB 2.0 ports, one EIDE and one Gigabit Ethernet interface facilitate fast and flexible system extensions. Besides PEG 3.0, VGA and LVDS are supported, as well as DirectX 11, OpenGL 3.1 and OpenCL 1.1. Fan control, LPC bus for easy connection of legacy I/O interfaces, and Intel high definition audio round off the set of functions.
Click on image to enlarge.
All conga-BP77 modules are fitted with the new embedded firmware solution, UEFI. Under UEFI, congatec's embedded BIOS features are also supported and extended. Even larger applications can now be integrated with the new pre-boot application. This way, regardless of the operating system in use, embedded diagnostic tools, network-based service programs or system recovery applications can be used.
A matching evaluation carrier board for COM Express Type 2 enabling fast implementation of a PCI Express graphics x16-lane plug is also available.
More information
The conga-BP77 is available now with processor support for Intel Core i7-3612QE (4 x 2.1 GHz, 6 MB Intel Smart Cache, TDP 35W), Intel Core i7-3555LE (2.50 GHz, 4 MB Intel Smart Cache, 25W) and Intel Core i5-3610ME (2.7 GHz, 3 MB Intel Smart Cache, 35W). The module features the new mobile Intel Express chip set QM77 and offers up to 16 GByte dual channel DDR3 memory (1600 MT/s).
Six PCI Express 2.0 lanes, four SATA interfaces with up to 6 GB/s and RAID support, eight USB 2.0 ports, one EIDE and one Gigabit Ethernet interface facilitate fast and flexible system extensions. Besides PEG 3.0, VGA and LVDS are supported, as well as DirectX 11, OpenGL 3.1 and OpenCL 1.1. Fan control, LPC bus for easy connection of legacy I/O interfaces, and Intel high definition audio round off the set of functions.
Click on image to enlarge.
All conga-BP77 modules are fitted with the new embedded firmware solution, UEFI. Under UEFI, congatec's embedded BIOS features are also supported and extended. Even larger applications can now be integrated with the new pre-boot application. This way, regardless of the operating system in use, embedded diagnostic tools, network-based service programs or system recovery applications can be used.
A matching evaluation carrier board for COM Express Type 2 enabling fast implementation of a PCI Express graphics x16-lane plug is also available.
More information
Navigate to related information
Most Popular
Datasheets.com Parts Search
185 million searchable parts
(please enter a part number or hit search to begin)
Browse the technical library
Our technical library houses over 4,000 high-quality sponsored white papers, application notes, reference guides, use cases—all organized by company.
Our technical library houses over 4,000 high-quality sponsored white papers, application notes, reference guides, use cases—all organized by company.

