TI launches next-gen WiLink

Texas Instruments Incorporated (TI) has introduced the WiLink™ 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios for next-generation mobile Wi-Fi®, GNSS, NFC, Bluetooth® and FM transmit/receive applications. Each chip variant comes in a compact WSP package that can be mounted directly on a PCB and includes required RF front end circuitry for 2.4 and 5GHz, a power management system, and coexistence mechanisms. TI claims that at the system level, the five-radio WiLink 8.0 chip offers a 60 percent cost reduction, 45 percent decrease in size and 30 percent lower power consumption compared to traditional multi-chip offerings.
 
WiLink 8.0 includes integrated, five-radio WL189x solutions for smartphones, tablets, eBooks, and ultrathin computing devices. The WL187x, WL185x and WL183x solutions provide additional options for higher to mid-tier devices, while the WL180x solutions address lower-cost mobile markets. All include integrated RF front ends for both 2.4GHz and 5GHz.
 
WiLink 8 solutions are available for all Wi-Fi throughput ranges using either 2x2 MIMO or SISO 40MHz. Capable of reaching more than 100Mbps Wi-Fi TCP throughput on the 2.4GHz and 5GHz bands, the chips are designed for fast mobile streaming and high-definition (HD) mobile video capabilities, including Wi-Fi Direct™ and wireless display.
 
The WiLink 8.0 combo chip with integrated NFC yields a more than 50 percent size reduction as compared to non-combo solutions. The WiLink 8.0 GNSS core includes a complete position engine on chip to reduce system-level power consumption and enables host-independent, on-chip geo-fencing and location buffering.
 
Products with WiLink 8.0 solutions inside are expected to ship in the second half of 2012.
 
For more information:
Chip demonstrations at Mobile World Congress, TI booth (Hall 8, Stand 8A84)
WiLink 8.0 introduction video