Texas Instruments Incorporated (TI) has introduced the WiLink™ 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios for next-generation mobile Wi-Fi®, GNSS, NFC, Bluetooth® and FM transmit/receive applications. Each chip variant comes in a compact WSP package that can be mounted directly on a PCB and includes required RF front end circuitry for 2.4 and 5GHz, a power management system, and coexistence mechanisms. TI claims that at the system level, the five-radio WiLink 8.0 chip offers a 60 percent cost reduction, 45 percent decrease in size and 30 percent lower power consumption compared to traditional multi-chip offerings.
WiLink 8.0 includes integrated, five-radio WL189x solutions for smartphones, tablets, eBooks, and ultrathin computing devices. The WL187x, WL185x and WL183x solutions provide additional options for higher to mid-tier devices, while the WL180x solutions address lower-cost mobile markets. All include integrated RF front ends for both 2.4GHz and 5GHz.
WiLink 8 solutions are available for all Wi-Fi throughput ranges using either 2x2 MIMO or SISO 40MHz. Capable of reaching more than 100Mbps Wi-Fi TCP throughput on the 2.4GHz and 5GHz bands, the chips are designed for fast mobile streaming and high-definition (HD) mobile video capabilities, including Wi-Fi Direct™ and wireless display.
The WiLink 8.0 combo chip with integrated NFC yields a more than 50 percent size reduction as compared to non-combo solutions. The WiLink 8.0 GNSS core includes a complete position engine on chip to reduce system-level power consumption and enables host-independent, on-chip geo-fencing and location buffering.
Products with WiLink 8.0 solutions inside are expected to ship in the second half of 2012. For more information
Chip demonstrations at Mobile World Congress, TI booth (Hall 8, Stand 8A84)WiLink 8.0 introduction video