® An EE Times Member Company

Screaming Circuits provides customized solutions for the quick-turn prototype PC board assembly market. The company assembles prototype, pilot production, and short-run production PC boards. Technical capabilities include machine-placed, surface-mounted technologies (SMT) down to 0201 components, fine-pitch parts, BGA and leadless parts; board finishes such OSP and ENIG; board types such as rigid, flex, rigid-flex, ceramic and metal core; and virtually any layer count or board size.

Recent Additions

The Top 10 Issues that Cause Bad Prototypes
Please Select... : White Paper
As a prototype assembly house, Screaming Circuits is regularly called upon to fix issues driven by compressed product development cycles. They thought it would be valuable to create a "Top Ten" checklist of issues that they see on a regular basis. Read this paper to learn more.

Five Via-in-Pad Myths
Please Select... : White Paper
This paper evaluates common misconceptions about the use of via-in-pad as a viable design technique. It takes the perspective that via-in-pad is a design tool that can be used correctly or incorrectly, and shows examples of both good and bad design.

10 Ways to Reduce Cost in Outsourced Prototyping
Please Select... : White Paper
Many original equipment manufacturers (OEMs) are faced with insufficient internal product development resources, while at the same time an increased workload.

The Top 10 Issues That Cause Bad Prototypes
Please Select... : Educast
Parts and pitch get smaller. Pin counts get larger. Design cycles get shorter. BGA, MicroBGA, QFN, DQFN, CSP packages are taking the design world by storm. Learn how to avoid the most common trip-ups when designing with these packages. Also learn how the various board finishes can impact the use of advanced package components in a prototype world.

How to succeed the first time with ultra-small QFN packages
Please Select... : Design How-To
Learn how to avoid the layout pitfalls of small QFN packaging and take advantage of its superior grounding and thermal properties.

Via In Pad Guidelines
Please Select... : White Paper
The practice of placing vias in surface mount pads is becoming more and more common with today's ultra small surface mount componentry. If implemented improperly, placement may lead to unreliability or failure of the assembly. This white paper outlines potential problems, as well as a number of solutions and methods that result in reliable assemblies.

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