LatticeXP2 non-volatile FPGAs move into volume production

The folks at Lattice Semiconductor have announced that the 17K LUT LatticeXP2–17 device, one of five members of its third-generation non-volatile LatticeXP2 FPGA family, has been fully qualified and released to volume production.

Designed using what Lattice claim to be the industry's most advanced non-volatile FPGA technology – a 90 nm embedded Flash process manufactured on 300 mm wafers – the LatticeXP2 devices provide the "instant-on" and reduced footprint benefits of earlier Lattice non-volatile devices, while also enhancing design security, RAM back-up and live update capabilities.

The production release of the LatticeXP2-17 comes approximately nine months following the initial product announcement. The folks at Lattice say that this rapid time to production demonstrates their ongoing commitment to leadership in the non-volatile FPGA segment, and to delivering "More of the Best" to their customers.

flexiFLASH architecture
The LatticeXP2 family consists of five members, with logic capacities from 5K to 40K 4-input Look Up Tables (LUTs). I/O counts across the family range from 86 to 540 in space-saving package configurations as small as an 8 mm × 8 mm chip-scale BGA package (csBGA).

Embedded block memory provides up to 885 Kbits in 18 Kbit dual port blocks. For small scratch pad memories, LUTs can also be converted into small, distributed memory blocks. To support increasingly common DSP applications, up to eight sysDSP blocks provide hardwired high-performance pipelined multiply and accumulate functions. The devices have up to four Phase Locked Loops (PLLs) that allow designers to align and synthesize clocks as required in their designs.

Flash memory blocks are embedded within LatticeXP2 FPGAs to store the device configuration, providing a true single chip solution that Lattice calls the flexiFLASH architecture. At power-up or on user command, the data stored in the Flash memory is transferred into SRAM cells that control the configuration of the device. This transfer is done in a massively parallel fashion, enabling the device logic to be available in approximately 1 ms. This is well ahead of the other devices in the system and much faster than SRAM-based FPGAs that use external boot PROMs, regardless of whether they are provisioned separately on-board or stacked in the same package. This instant-on capability is critical for many system functions such as power up sequencing, address decoding and reset logic.

Lattice say that by keeping the configuration bitstream on-chip, the LatticeXP2 devices are also inherently more secure than alternative multiple device or multi-chip module solutions. This security is enhanced by configuration read-back protection modes. A 64-bit erase/program lock protects against accidental or unauthorized device programming. A one time programmable (OTP) mode is provided for ultimate protection against unauthorized programming. Optional 128-bit AES encryption can be used to secure programming data being passed into the device.

Design tools and intellectual property
Design support for the LatticeXP2 family is provided by the latest generation of Lattice's ispLEVER design tool suite, version 7.0 with Service Pack 2. In addition to providing design support for the LatticeXP2 family, the version 7.0 release provides major general enhancements including substantial speed and utilization improvements for all Lattice FPGA families, a greatly enhanced Power Calculator module, and the Reveal design analysis tool with advanced logic analysis triggering capabilities. Customers can also choose from an extensive library of IP cores, shortening the design cycle and accelerating time to market.

Availability and pricing
The LatticeXP2-17 is available now in two package options (256 ftBGA and 484 fpBGA). Prices for the LatticeXP2-17 start at $9.95 for delivery in the second half of 2008 in 100,000 piece quantities.