QuickLogic's ArcticLink platform now available in wafer-level chip-scale packaging

Continuing their commitment to address the needs of the mobile device market, the folks at QuickLogic have made their ArcticLink Customer Specific Standard Product (CSSP) platform available in a tiny Wafer Level Chip Scale Package (WLCSP).

The ArcticLink platform family addresses the connectivity needs of mobile devices by offering, in a single device, an array of configurable interfaces and host controllers, including hi-speed USB OTG with built-in PHY, storage and networking I/Os and controllers such as SDIO, MMC, CE-ATA, mini-PCI, Compact Flash and SPI/UART, etc. The newly-available WLCSP option helps minimize mobile device design size needed to augment processor interfaces and functionality.

WLCSP eliminates the area overhead of conventional BGA packaging and it is achieved with a standard die by fabricating an additional metal redistribution layer to re-route the I/O lines from the perimeter bonding pads to an array. It then "bumps" (adds solder balls to) the array, making it ready for customers to use in conventional surface-mount fabrication processes.

Availability
The WLCSP packaging option is immediately available for QuickLogic's ArcticLink CSSP platform family. Visit www.quicklogic.com for more details.