SAN FRANCISCO—Thermal management solutions vendor Cool Innovations Inc. is offering a new line of integrated fansinks composed of a pin-fin heat sink and a fan that is embedded into the heat sink's pin array.

According to Cool Innovations (Toronto) this configuration allows for the creation of extremely low-profile active cooling solutions. The heat sinks possess substantial surface area and are composed of highly conductive materials, the company said. The structure is suitable for fansink configurations and the use of round pins generates additional turbulence inside the pin array, according to the company.

The integrated fansink line was specifically designed for applications that are restricted in height, yet require substantial cooling power, Cool Innovations said. Solutions are available from a minimum overall height of 0.42'' to a maximum overall height of 0.63 '', the company said. They are suited to fit into single slot PCI Express and ATCA applications or for any other applications that are restricted in height, according to the company.

The integrated fansinks are available in copper and aluminum, and range in footprint from 1.81'' x 1.81" to 4.10" x 2.05", and in height from 0.42" to 0.63", according to the company.