datasheets.com EBN.com EDN.com EETimes.com Embedded.com PlanetAnalog.com TechOnline.com  
Events ▼
UBM Tech
UBM Tech ▼

Product Brief

Sigrity enhances IC package modeling pak


7/22/2009 9:00 AM EDT
Sigrity unveiled a new version of its XtractIM product that allows package designers to assess performance of signal and power delivery nets intuitively, characterize a broader set of package types, and extract electrical models with improved accuracy.

According to Sigrity its XtractIM 3.0 has the following enhancements suggested by engineers at Altera and Qualcomm:

  • a practical assessment method for complex SiP power delivery nets, and support for single-die packages

  • electrical performance assessment capabilities has a new signal net assessment analysis and results display

  • supports quad flat pack (QFP), quad flat pack no leads (QFN), and VQFP

  • refined analysis engine component models for vias, pads and traces in support of single-segment RLGC or IBIS models.

    With XtractIM, users can observe both die- and board-side package issues, including places where the design may not meet specified per-pin resistance and inductance.

    XtractIM goes beyond typical extraction to provide novel power/ground assessment capability with automated results that correspond to the specifications provided by IC design teams.

    The initial release of XtractIM in October 2006 provided more than a 10-times speedup for package model extraction. It further delivered a new level of capacity to consider the full package in a single analysis, according to the company.

    XtractIM 3.0 is now available for download by existing XtractIM users.



    • Please sign in to post comment

    Navigate to related information

    Datasheets.com Parts Search

    185 million searchable parts
    (please enter a part number or hit search to begin)
    Browse the technical library
    Our technical library houses over 4,000 high-quality sponsored white papers, application notes, reference guides, use cases—all organized by company.