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Datasheets.com Electronic Parts & Inventory Search
185 million searchable parts
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Logic & Interfaces
Product How Tos
Open-Silicon updates 'Interlaken' IP core
AMD aims 'most capable' processor at embedded
Cadence, Northrop Grumman team on space ASICs
Silicon Labs rolls wireless remote control SoC
XMOS announces first USB Audio 2.0 Reference Design with support for high audio channel count
SiLabs breaks low-power record for touch-sense MCUs
TI offers USB 3.0 IC for 5-Gbit/s transfers
IAR Systems supports new Freescale MCU families
Sensors integrate ColdFire processor, MEMS accelerometer
Product Reviews
Hi-Speed USB protectors let drivers safely recharge their USB devices
Maxim Integrated Products provides high ESD protection with its fully integrated USB 2.0 protectors to safely and quickly connect drivers to mobile ...
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Repeaters/retimers extend FR-4 signal reach beyond 50 inches at 10-Gbps
TI claims its latest advanced signal conditioners deliver industry's highest performance at lowest power.
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Samplify Systems announces APAX application acceleration technology
Accelerate application performance in data centers and cloud computing, as well as FPGAs and also ASICs/SoCs and application processors used in ...
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Comparison Tables
Technical Papers
Embedded Computing's Shift to Serial Point-to-Point Architectures
A Perfect Match: OMAP 4 Platform and Android 4.0 Ice Cream Sandwich
Developing state-of-the-art user interfaces for today's set-top box TV and IPTV applications
On-chip Flash Memory Reprogramming in Single Chip Mode
Introducing SPI Storm
The Stellaris Graphics Library Makes Short Order of Assembling a Dynamic HMI
OMAP 4 Mobile Application Platform
Wide-Vin Battery Charger Using SMBus Communication Interface Between MSP430 MCUs and bq Fuel Gauges
High Temperature Guide
Protecting RS-485 Interfaces Against Lethal Electrical Transients
Courses and Webinars
Accelerating Productivity with Xilinx 7 Series Targeted Design Platforms
Introducing the New No Offset Bus Buffers
NXP Analog Switch Design and Applications
Breakthrough in High Speed Interconnect Analysis and Compliance Testing
Building High-Performance SoCs with Configurable and Extensible Processors
Calibre® PERC™: Effective Reliability and Low Power Verification
Technology and Tips for Developing Rich UIs on IPTV and Set Top Box Products
TI's New Space Saving Package
Experiences optimized on the OMAP platform
Create Best in Class UIs and Save on Development Cost
Commentary
Finding the right part just got easier
Patrick Mannion
With the launch of Datasheets.com, EDN and UBM Electronics provide engineers access to over 185 million parts, with features such as comparison, parametric search, search save, and alerts.
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22 comments
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Dr DSP
It seems like the next phase of this effort needs to be driven by suggestions from users on the ...
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22 comments
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Dr DSP
It seems like the next phase of this effort needs to be driven by suggestions from users on the ...
Sometimes a minor spec can be a major feature
Michael Hughes
Everything was fine, except for the 'correct' position. That's when things got challenging.
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9 comments
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prabhakar_deosthali
Very nice article . It shows that persistence pays. and even some trivial looking information on a ...
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9 comments
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prabhakar_deosthali
Very nice article . It shows that persistence pays. and even some trivial looking information on a ...
Raising alarms in the design group
John Rettig
I wasn't the instigator but my reputation made me the prime suspect
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7 comments
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David Ashton
Guilty as charged...kind of.... I've fallen into this trap a couple of times.... assuming that the ...
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7 comments
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David Ashton
Guilty as charged...kind of.... I've fallen into this trap a couple of times.... assuming that the ...
There is Life After End of Life
George Karalias
Navigating the pitfalls of a semiconductor device's end-of-life need not cripple a company.
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What's inside the Dell Streak and Archos 7 tablets?
Brian Fuller
Patrick Mannion and I tear down the Dell Streak and Archos 7 tablet PCs live at ARM TechCon.
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3 comments
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ReneCardenas
Is the power point presentation available electronically?. I agree with EE.Mod posting the tables ...
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3 comments
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ReneCardenas
Is the power point presentation available electronically?. I agree with EE.Mod posting the tables ...
When products go beyond the bottom line
Brian Fuller
It's when products have an impact that's felt beyond the top and bottom lines that engineers can go home with a really warm feeling in their hearts.
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5 comments
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lifewingmate
I agree, this story is amazing because at the end of the day life-saving technologies are priceless. ...
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5 comments
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lifewingmate
I agree, this story is amazing because at the end of the day life-saving technologies are priceless. ...
Look who’s eating your lunch again
Brian Fuller
A focus on manufacturing is probably why Japan is winning design-ins with Apple.
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15 comments
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Brian Fuller2
There's a balance to be struck. As an industry, we've spent the last three decades trying to ...
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15 comments
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Brian Fuller2
There's a balance to be struck. As an industry, we've spent the last three decades trying to ...
EE Times' 20 hot technologies for 2012
Peter Clarke, Rick Merritt, Nicolas Mokhoff
What follows is a list of 20 technologies EE Times editors think can bring big changes, and that we will be tracking in 2012.
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53 comments
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Tunrayo
Agreed, the field of biometrics is still ripe for innovation.
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53 comments
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Tunrayo
Agreed, the field of biometrics is still ripe for innovation.
Models, models, models…
Brian Bailey
Without models the EDA industry could not exist and when it comes to trying to promote a new abstraction level, models become the sticking point. Synopsys intends to change that…
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3 comments
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Robotics Developer
I see the same thing with PCB layout tools and the associated schematic capture tool libraries! ...
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3 comments
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Robotics Developer
I see the same thing with PCB layout tools and the associated schematic capture tool libraries! ...
LSI's Talwalkar May Be AMD's Best Hope 
Rick Merritt
The most interesting moment of my hour with LSI Corp. CEO Abhi Talwalkar yesterday came about half way through the wide-ranging interview. I asked him about the open AMD CEO job and he visibly choked.
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Recent Comments
Tom Phalen 02.11.2012
Viewpoint: 'The R&D credit doesn't work'
Viewpoint: 'The R&D credit doesn't work'
The level of management I deal with are the CFO, VP Eng., Project Heads, Engineers, etc. I am very ...
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55 comments
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55 comments
FTD Automation 02.11.2012
The dumbing down of embedded design
The dumbing down of embedded design
Register at www.ftdautomation.com
Free Seminar on Technology Trends in High Speed PCB Design and ...
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34 comments
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34 comments
WW Thinker 02.11.2012
Rumored Japanese chip merger by the numbers
Rumored Japanese chip merger by the numbers
ST-E is not looking good at the moment especially considering the mega-merge happened even earlier ...
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19 comments
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19 comments
ProductPressRelease
Broadcom launches connected-car Ethernet portfolio
Integrated transceivers save space in LIN, CAN applications
Altium and FTDI Chip Collaborate on New Board-Level Components
Tech Company First to Market Interactive 3D Affordable Children's Books & Toys in the US
American Nurses Association Uses Charity Dynamics' Boundless Voices® to Expand Reach and Build Stronger Network of Advocates
iTwin Launches Multi Functionality
RTA Products Announces New Workspace and Ergonomic Solutions at CES 2012
Buffalo's Revolutionary CloudStor Shipping Worldwide
GotoCamera Launches Free Apple Macintosh Application, Enabling Easy and Affordable Home & Office Monitoring Using iSight, FaceTime, and USB Webcams
CaseInity Launches "Cord-On-Board" and Revolutionizes the iPhone Accessory Market
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Power MOSFETs continue to evolveIncreases in power-MOSFET performance now come not just from tweaks in the silicon device's structure but also from innovations in manufacturing processes and packaging.
