Product Brief
TI’s 4-MB flash memory targets harsh environments
1/8/2013 11:32 AM EST
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Texas Instruments Inc. (TI) debuts the SM28VLT32-HT non-volatile flash memory device for harsh environments. The high-temperature device offers an operational capacity of 4MB and cuts the need for costly up-screening and qualification testing of industrial-grade components for temperature ranges outside data sheet specifications.
The device is qualified to operate from -55ºC to +210ºC and allows data logging at extreme temperatures. It is guaranteed for at least 1,000 hours of operating life in harsh environment applications, including oil and gas exploration, heavy industrial, and avionics. It is tested across the entire temperature range to provide robust read/write operation over the device's operating life. It also eliminates the need for external parts allowing manufacturers to develop applications for harsh environments quickly and safely, and cuts development, testing, and qualification time by six months.
Available in either a ceramic flat pack or in Known Good Die (KGD), the device features a serial SPI interface that is said to simplify design and packaging, and reduce pin count. The device also enables small package integration into multi-chip modules for systems with limited board space.
The SM28VLT32-HT is sampling now in an 8-mm x 25-mm ceramic flat pack.
This product originally appeared on the website of EE Times India.
The device is qualified to operate from -55ºC to +210ºC and allows data logging at extreme temperatures. It is guaranteed for at least 1,000 hours of operating life in harsh environment applications, including oil and gas exploration, heavy industrial, and avionics. It is tested across the entire temperature range to provide robust read/write operation over the device's operating life. It also eliminates the need for external parts allowing manufacturers to develop applications for harsh environments quickly and safely, and cuts development, testing, and qualification time by six months.
Available in either a ceramic flat pack or in Known Good Die (KGD), the device features a serial SPI interface that is said to simplify design and packaging, and reduce pin count. The device also enables small package integration into multi-chip modules for systems with limited board space.
The SM28VLT32-HT is sampling now in an 8-mm x 25-mm ceramic flat pack.
This product originally appeared on the website of EE Times India.
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