Toshiba America Electronic Components, Inc. (TAEC) expanded its line of Dynastron image sensor and chip
scale camera modules (CSCMs) with the introduction of a new 8-megapixel (MP) CMOS
image sensor and a 2MP CSCM in a 1/5-inch optical format. Both of these devices use Toshiba's 1.75-micron image sensor process technology which was designed to address the needs of the mobile handset market by delivering large pixel
counts in a small form factor and capturing high-quality images in low-light conditions.
The 8MP Dynastron image sensor (part number ET8ER4-AS) is designed for use in high-end camera phones that offer auto-focus or optical zoom capabilities. It is available in a 1/2.5-inch optical format
and is optimized for low-light environments. Higher resolution
is a moving target for mobile devices where two years ago a 3MP image sensor was the goal, which was increased to a 5MP image sensor last year. For 2009 the expectation is to improve to an 8MP sensor with continued development in the coming years.
The 2MP CSCM uses the Toshiba through chip via technology to allow mounting and assembly of camera components in the chip wafer during manufacturing to reduce the size by as much as 64 percent in comparison to other camera modules. It features an integrated image signal processing function to give the CSCMs more digital still capture-type functionality. The purpose for this sensor is to enable video conferencing by having the CSCM focusing on the user.
Pricing and Availability
Engineering samples of the 8MP image sensor are available now, with mass production scheduled to begin in Q2 2009. It is sample priced at $20 each. The 1/5-inch format 2MP CSCM will be in mass production in Q2 2009 and is sample priced at $10 each.