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Silicon carbide ready for prime time
R Colin Johnson2/25/2008 9:00 AM EST
"Silicon carbide is much harder and more expensive to process than silicon," said Neudeck. "Our prolonged 500 degree C demonstration chip was achieved through the successful development and integration of a number of fundamental materials and processing advancements here at NASA."
One key obstacle, he said, was development of the metal-semiconductor contacts needed to carry electrical signals in and out of SiC transistors. NASA colleague Robert Okojie overcame that problem with contacts that have survived "thousands of hours of testing at 500 degrees C," Neudeck said.
In addition, he said, the team overcame other challenges "in high-temperature packaging, insulators and integration into a single process run."
NASA will use the world's first commercial silicon carbide chip to monitor linear motion inside its jet turbine engines, but Inprox sees other uses as well.
"Our device will be the first to utilize the extreme-temperature tolerances that silicon carbide enables," said Derek Weber, president and co-founder of Inprox. "Our silicon carbide device will be a standard operational device that NASA can use, but from there we can turn it into a surface-mountable device or a microelectromechanical system."
Inprox, Weber said, "feels this is a device with commercial value not only for aerospace, but also for automotive and industrial applications."
Linear position sensors ordinarily use three coils--a master coil and two slaves. A ferrite magnetic actuator moves through these coils, making linear variable differential transformers, a five-terminal device that requires complicated analog conditioning circuitry to attain high resolution.
Inprox's linear position sensor, by contrast, uses a proprietary captive-field linear-direct (CFLD) approach, an all-digital solution yielding ultrahigh resolution that nevertheless requires only a single coil, no ferrite actuator and no analog conditioning circuitry.
"The biggest reason our approach is attractive is that we cut the number of terminals from five to two, eliminate the ferrite actuator, eliminate two of three coils, reduce the mass by as much as 90 percent and require no analog signal-condition circuitry, which saves board space that is at a real premium for aerospace applications," said Weber.
Inprox's CFLD sensors provide a continuously variable square-wave output, where linear position is directly proportional to the frequency of the square wave. Instead of attaching a complicated actuator to the object whose motion is being measured, an extremely simple actuator can be built into the moving object itself to affect the flux density of a single coil, which in turn changes the frequency of the sensor's square-wave output.
The square-wave output from Inprox sensors can be set to range from as low as 50 kHz up as high as 1 MHz, providing extremely high resolution and dynamic range compared with conventional analog sensors. The only part of a captive-field linear-direct sensor that is analog is the actuator itself--everything else is digital.
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SiCasaparrot
2/26/2008 3:57 AM EST
Can you explain why, if this is the world's first SiC IC, Inprox are talking about simplifying the design? Does Endevco's existing deal with NASA not qualify as the the first SiC IC?
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sensorsic
5/15/2008 8:33 AM EDT
Other efforts have demonstrated operation of SiC IC's at much lower (T < 350C) temperatures, or very brief (less than few hours) operation at T 500C.
NASA's SiC integrated circuit is the first semiconductor integrated circuit (for ANY semiconductor material) ever reported to demonstrate prolonged stable electrical circuit operation at 500 C. NASA is at 5000 hours of 500 C electrical operation and still counting for one of their demonstration circuits. This "proof of principle" demonstration differential amplifier integrated circuit only had three resistors and two transistors. The NASA / ITC goal for the next generaton of SiC chips that are fabricated starting from scratch is to increase the transistor count at least 100-fold. The process of up-scaling the SiC integrated circuitry to much higher levels of integration (i.e., up-scaling to IC chips with thousands of transistors) should be straightforward from previously developed silicon and GaAs IC technology, so the belief is that this can occur pretty rapidly now that the thermal durability breakthrough has been made.
In 2000 NASA used an Endevco silicon-based accelerometer as the benchmark to validate the NASA Glenn SiC high-g accelerometer. Tests showed the NASA device operated as well as the Endevco benchmark device, but at higher temperatures. This initial result led to discussions between Endevco and Glenn about licensing opportunities to acquire Glenns SiC pressure and accelerometer sensor fabrication and packaging technologies. A license to three patents was eventually signed.
The ITC work is moving the technology into the realm of commercial viability for on engine SiC hardware.
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