New H-PSOF power-electronics packaging touts high-current capability and high efficiency

Infineon has introduced new packaging technology to provide high-current capability and high efficiency for demanding automotive electronics applications, including electric and hybrid vehicles. The new TO package is compliant with JEDEC standard H-PSOF (Heatsink Plastic Small Outline Flat lead). The first available products using the H-PSOF package technology are 40V OptiMOS™ T2 power transistors offering up to 300A current capability in addition to an R_DS(on) of 0.76 mΩ.

Higher performance power electronics components help automotive system designers comply with government regulations mandating higher standards for fuel efficiency while also demanding lower overall emissions. To meet these standards, power MOSFETs with current capability above 200A and R_DS(on) below 1 mΩ are needed to reduce conduction losses and improve overall efficiency.

With introduction of the H-PSOF package, Infineon provides the 40V power MOSFET performance noted above within a smaller overall package. The dimensions and the height of the H-PSOF package were reduced compared to a standard D²PAK package (TO-263) typically used in such applications. The footprint of the H-PSOF package is about 20% smaller and its height is almost half that of the current D²PAK package.

High-current applications which the H-PSOF package was designed for include battery management for hybrid and electric vehicles, electric power steering (EPS), active alternators, and other heavy load applications enabling higher efficiency and lower emissions. An example of a growing application areas, cited by the U.S. market research firm Strategy Analytics in a recent report, are automotive EPS and start/stop systems. These will grow from about 47 million units in the year 2011 to about 110 million units in 2016, for a compound average annual growth rate of about 19%.

The company says the main goal for the development of the H-PSOF package was to decrease the package resistance and increase the current capability of the package compared to the D²PAK offering high-current capabilities.

The H-PSOF package also has assembly and manufacturing advantages. Its special design ensures a good wetting for reliable soldering and it is possible to control the soldered leads by using automatic optical inspection, which is usually part of a surface-mount technology production line.

Availability
The first available product using the H-PSOF package is the IPLU300N04S4-R7, a member of the 40V OptiMOS T2 automotive power transistor family from Infineon, which is also used for applications in energy efficiency, CO₂ reduction, and electric drives. The IPLU300N04S4-R7 offers a continuous drain current (I_D) of 300A with R_DS(on) of 0.76 mΩ. The power devices in the H-PSOF package are qualified according to AEC-Q101 standards. Infineon plans to introduce further 40V and 30V automotive MOSFETs using the H-PSOF package technology.

Further information
Click here for further information on Infineon’s automotive MOSFETs and automotive semiconductors.

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