Product Brief
16-bit sensor signal conditioner delivers high resolution, low power
Ismini Scouras1/25/2012 11:19 AM EST
Comment
jg_
However, "The ZSSC3016 is available as die for wafer bonding" rather limits the ...
hm
It looks like Multi Chip Module. Or is it SoC? However, price is highly ...
ZMD AG (ZMDI) has introduced a 16-bit sensor signal conditioning IC (SSC) for calibrated resistive sensor modules.
The ZSSC3016 combines high accuracy amplification, 16-bit precision analog-to-digital conversion, and an 18-bit DSP for linearization and calibration functions. The high resolution sensor interface ASSP provides special features for battery driven low power devices, such as an overall current consumption of less than 1mA combined with an ultra low standby current of less than 250nA, operation voltages between 1.8 and 3.6V and an intelligent power save scheme to ensure lowest overall current consumption.
Designed for high resolution altimeter module applications, the ZSSC3016 is intended for use in mobile phones, sport watches or outdoor GPS tracking systems.
Key highlights:
- Broad power supply range of 1.8 – 3.6 V
- Low current consumption of <1mA and stand-by current of <250nA
- Noise-free 16-bit output signal for altitude resolution of < 15cm at sea level
- Fully-corrected digital output signal simplifying the system design
- Power supply rejection ratio of up to 90dB at 2V for mobile devices
- One-pass calibration reduces BOM and manufacturing costs
- Operates at a temperature range of -40°C to +85°C
Pricing: Parts are priced at 0.78 Euro / US$1.09 in volumes of 10k.
Availability: The ZSSC3016 is available as die for wafer bonding. Samples and wafer material are available now.
Datasheet: Click here.
Most Popular
Datasheets.com Parts Search
185 million searchable parts
(please enter a part number or hit search to begin)
Our technical library houses over 4,000 high-quality sponsored white papers, application notes, reference guides, use cases—all organized by company.



hm
1/25/2012 8:55 PM EST
It looks like Multi Chip Module. Or is it SoC? However, price is highly attractive.
What is bandwidth for this type of MCm or SoC?
Sign in to Reply
jg_
1/25/2012 11:17 PM EST
However, "The ZSSC3016 is available as die for wafer bonding" rather limits the customer base...
Sign in to Reply