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Via rolls embedded chipset line
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EE Times


SAN JOSE, Calif. — At the Embedded Systems Conference (ECS) here, Taiwan’s Via Technologies Inc. rolled out a chipset for embedded applications.

The VIA CX700 digital media IGP chipset is optimized for Via’s own C7 and Eden line of x86-based processors. The chipset includes several features on the same chip: video graphics, HD audio, and DDR2 and SATA II support.

The chipset also include the UniChrome Pro IGP core, which consists of 128-bit 2D/3D graphics, MPEG-2 video decoding acceleration and intelligent video rendering. It supports DDR-400 and DDR-2533 memory with up to 4-GB with ECC capability.

In the CX700, Via has integrated all the key functionality of both the north and south bridges of the chipset. The X700 is expected to be available in volume quantities later in Q2 2006. Pricing is available upon request.






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