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EE Times | EE Times Image Galleries

Advanced Technology Week in Review: June 6 Page 1 of 7
IBM uses water to cool 3D chip stacks	IBM's Zurich Research Laboratory has demonstrated water-cooled 3D chip stacks. IBM expects to commercialize the process for its multicore servers. By stacking memory chips between processor cores, the process can multiply interconnections by 100 times while reducing their feature size tenfold. View Article

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