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Custom Circuits
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Innovative ideas leap design hurdles at CICC
The IEEE Custom Integrated Circuits Conference (CICC) has been the prime venue for new perspectives on the toughest problems facing IC designers. This year's event, to be held this week in Orlando, Fla., offers a fresh crop of innovative circuit design ideas, some of which are excerpted in this week's Focus section.


  • Ac scheme bumps I/O density
  • MOSFET design simplifies DRAM
  • Flexible I/O speeds data switch


  • Field programmable mixed-signal SoC offer more levels of integration
  • Vector architecture optimized for DSP imaging/wireless apps
  • Reconfigurable processor combines extensible core with SRAM-based FPGA
  • 600-MHz DSP handles more channels, prepped for 3G basestations
  • In-P HBTs fill high- speed, low power optical tranceiver requirements
  • Adaptive approach needed for 10 Gbit/s backplanes






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