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Packaging Issues
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EE Times



IC packaging raises modeling, layout concerns in communications design
IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits.


  • CAD tackles package parasitics
  • BGAs jump speed/density barrier


  • RF system-in-package competes with SoCs
  • QFN packages quell noise, cost, space in handhelds






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