Smart Partitioning could be path to Integration
By Tony Caviglia
By As systems-on-chip become more pervasive, designers will need to address the question of when to integrate RF functionality on more and more projects.

Ultrasparc III Passes Physical Verification
By Ward Vercruysse and John Ferguson
By Since 1990, Sun Microsystems has tracked factors affecting design complexity and productivity with an extensive set of indicators.

Digital Video IC Set For Debugging Ride
By Bart Vermeulen, Steven Oostdijk and Frank Bouwman
By With the decreasing feature sizes of state-of-the-art process technologies, design teams are faced with the challenge of quickly and efficiently mapping high-level functions onto a growing number of available transistors.

Subwavelength Size Traces Design Flows
By Michael Sanie
By As the semiconductor industry hit the 0.18-micron generation, it entered a new regime. For the first time, leading-edge device feature sizes became significantly smaller than the wavelength of light used by available best-in-class optical-lithography equipment.

Optimum Design via 'Smart' Partitioning
By Brian Harrington And Michael Burgener
By Communications systems continue to grow increasingly complex as product-development times shrink.

Editorial: New requisite: design-to-manufacturing
By Nicolas Mokhoff
By At the 0.18-micron process level, leading-edge device feature sizes become significantly smaller than the wavelength of light used by best-in-class optical-lithography equipment.

Index of Advertisers
By This is an index of advertisers in the February 2002 issue.

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