More and more OSATs in LCMRs / Far East have built up their in-house R&D capability and lately have been introducing new chip packaging solutions completely on their own. The Govt.s of Singapore & Taiwan ( to name just a few ) have set up well funded Research Institutes to develop new packaging & device technologies. What does that do to the business model of developing & licensing of technologies of companies based in the US ?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.