We come full circle. I remember when the PC was released. No heatsink and very low power. Too low in the beginning. It was a constant struggle to get quality power supplies with enough power for our increasing advancing processor technologies. It peaked out at the P4 Extreme series (Extremely hot running).
The Hummer of CPUs, fat, power hog, over priced and slow. Today, as green is in full gear and wafers are shrinking, so are the heatsinks and power requirements. Thank goodness. They will solve the 11nm power issue and I predict, laser/optical power will be used for the <10nm wafers, but it won't be cheap and heatsinks may be gone by that time, just like with the IBM original PC.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.